1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7	bool "Thermal drivers"
8	help
9	  Thermal drivers offer a generic mechanism for
10	  thermal management. Usually it's made up of one or more thermal
11	  zones and cooling devices.
12	  Each thermal zone contains its own temperature, trip points,
13	  and cooling devices.
14	  All platforms with ACPI or Open Firmware thermal support can use
15	  this driver.
16	  If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21	bool "Thermal netlink management"
22	depends on NET
23	help
24	  The thermal framework has a netlink interface to do thermal
25	  zones discovery, temperature readings and events such as
26	  trip point crossed, cooling device update or governor
27	  change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30	bool "Thermal state transition statistics"
31	help
32	  Export thermal state transition statistics information through sysfs.
33
34	  If in doubt, say N.
35
36config THERMAL_DEBUGFS
37	bool "Thermal subsystem debug support"
38	depends on DEBUG_FS
39	help
40	  Say Y to allow the thermal subsystem to collect diagnostic
41	  information that can be accessed via debugfs.
42
43config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
44	int "Emergency poweroff delay in milli-seconds"
45	default 0
46	help
47	  Thermal subsystem will issue a graceful shutdown when
48	  critical temperatures are reached using orderly_poweroff(). In
49	  case of failure of an orderly_poweroff(), the thermal emergency
50	  poweroff kicks in after a delay has elapsed and shuts down the system.
51	  This config is number of milliseconds to delay before emergency
52	  poweroff kicks in. Similarly to the critical trip point,
53	  the delay should be carefully profiled so as to give adequate
54	  time for orderly_poweroff() to finish on regular execution.
55	  If set to 0 emergency poweroff will not be supported.
56
57	  In doubt, leave as 0.
58
59config THERMAL_HWMON
60	bool
61	prompt "Expose thermal sensors as hwmon device"
62	depends on HWMON=y || HWMON=THERMAL
63	default y
64	help
65	  In case a sensor is registered with the thermal
66	  framework, this option will also register it
67	  as a hwmon. The sensor will then have the common
68	  hwmon sysfs interface.
69
70	  Say 'Y' here if you want all thermal sensors to
71	  have hwmon sysfs interface too.
72
73config THERMAL_OF
74	bool
75	prompt "APIs to parse thermal data out of device tree"
76	depends on OF
77	default y
78	help
79	  This options provides helpers to add the support to
80	  read and parse thermal data definitions out of the
81	  device tree blob.
82
83	  Say 'Y' here if you need to build thermal infrastructure
84	  based on device tree.
85
86choice
87	prompt "Default Thermal governor"
88	default THERMAL_DEFAULT_GOV_STEP_WISE
89	help
90	  This option sets which thermal governor shall be loaded at
91	  startup. If in doubt, select 'step_wise'.
92
93config THERMAL_DEFAULT_GOV_STEP_WISE
94	bool "step_wise"
95	select THERMAL_GOV_STEP_WISE
96	help
97	  Use the step_wise governor as default. This throttles the
98	  devices one step at a time.
99
100config THERMAL_DEFAULT_GOV_FAIR_SHARE
101	bool "fair_share"
102	select THERMAL_GOV_FAIR_SHARE
103	help
104	  Use the fair_share governor as default. This throttles the
105	  devices based on their 'contribution' to a zone. The
106	  contribution should be provided through platform data.
107
108config THERMAL_DEFAULT_GOV_USER_SPACE
109	bool "user_space"
110	select THERMAL_GOV_USER_SPACE
111	help
112	  The Userspace governor allows to get trip point crossed
113	  notification from the kernel via uevents. It is recommended
114	  to use the netlink interface instead which gives richer
115	  information about the thermal framework events.
116
117config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
118	bool "power_allocator"
119	depends on THERMAL_GOV_POWER_ALLOCATOR
120	help
121	  Select this if you want to control temperature based on
122	  system and device power allocation. This governor can only
123	  operate on cooling devices that implement the power API.
124
125config THERMAL_DEFAULT_GOV_BANG_BANG
126	bool "bang_bang"
127	depends on THERMAL_GOV_BANG_BANG
128	help
129	  Use the bang_bang governor as default. This throttles the
130	  devices one step at the time, taking into account the trip
131	  point hysteresis.
132
133endchoice
134
135config THERMAL_GOV_FAIR_SHARE
136	bool "Fair-share thermal governor"
137	help
138	  Enable this to manage platform thermals using fair-share governor.
139
140config THERMAL_GOV_STEP_WISE
141	bool "Step_wise thermal governor"
142	help
143	  Enable this to manage platform thermals using a simple linear
144	  governor.
145
146config THERMAL_GOV_BANG_BANG
147	bool "Bang Bang thermal governor"
148	default n
149	help
150	  Enable this to manage platform thermals using bang bang governor.
151
152	  Say 'Y' here if you want to use two point temperature regulation
153	  used for fans without throttling.  Some fan drivers depend on this
154	  governor to be enabled (e.g. acerhdf).
155
156config THERMAL_GOV_USER_SPACE
157	bool "User_space thermal governor"
158	help
159	  Enable this to let the user space manage the platform thermals.
160
161config THERMAL_GOV_POWER_ALLOCATOR
162	bool "Power allocator thermal governor"
163	depends on ENERGY_MODEL
164	help
165	  Enable this to manage platform thermals by dynamically
166	  allocating and limiting power to devices.
167
168config CPU_THERMAL
169	bool "Generic cpu cooling support"
170	depends on THERMAL_OF
171	help
172	  Enable the CPU cooling features. If the system has no active
173	  cooling device available, this option allows to use the CPU
174	  as a cooling device.
175
176if CPU_THERMAL
177
178config CPU_FREQ_THERMAL
179	bool "CPU frequency cooling device"
180	depends on CPU_FREQ
181	default y
182	help
183	  This implements the generic cpu cooling mechanism through frequency
184	  reduction. An ACPI version of this already exists
185	  (drivers/acpi/processor_thermal.c).
186	  This will be useful for platforms using the generic thermal interface
187	  and not the ACPI interface.
188
189config CPU_IDLE_THERMAL
190	bool "CPU idle cooling device"
191	depends on IDLE_INJECT
192	help
193	  This implements the CPU cooling mechanism through
194	  idle injection. This will throttle the CPU by injecting
195	  idle cycle.
196endif
197
198config DEVFREQ_THERMAL
199	bool "Generic device cooling support"
200	depends on PM_DEVFREQ
201	depends on PM_OPP
202	help
203	  This implements the generic devfreq cooling mechanism through
204	  frequency reduction for devices using devfreq.
205
206	  This will throttle the device by limiting the maximum allowed DVFS
207	  frequency corresponding to the cooling level.
208
209	  In order to use the power extensions of the cooling device,
210	  devfreq should use the simple_ondemand governor.
211
212	  If you want this support, you should say Y here.
213
214config THERMAL_EMULATION
215	bool "Thermal emulation mode support"
216	help
217	  Enable this option to make a emul_temp sysfs node in thermal zone
218	  directory to support temperature emulation. With emulation sysfs node,
219	  user can manually input temperature and test the different trip
220	  threshold behaviour for simulation purpose.
221
222	  WARNING: Be careful while enabling this option on production systems,
223	  because userland can easily disable the thermal policy by simply
224	  flooding this sysfs node with low temperature values.
225
226config THERMAL_MMIO
227	tristate "Generic Thermal MMIO driver"
228	depends on OF
229	depends on HAS_IOMEM
230	help
231	  This option enables the generic thermal MMIO driver that will use
232	  memory-mapped reads to get the temperature.  Any HW/System that
233	  allows temperature reading by a single memory-mapped reading, be it
234	  register or shared memory, is a potential candidate to work with this
235	  driver.
236
237config HISI_THERMAL
238	tristate "Hisilicon thermal driver"
239	depends on ARCH_HISI || COMPILE_TEST
240	depends on HAS_IOMEM
241	depends on OF
242	default y
243	help
244	  Enable this to plug hisilicon's thermal sensor driver into the Linux
245	  thermal framework. cpufreq is used as the cooling device to throttle
246	  CPUs when the passive trip is crossed.
247
248config IMX_THERMAL
249	tristate "Temperature sensor driver for Freescale i.MX SoCs"
250	depends on ARCH_MXC || COMPILE_TEST
251	depends on NVMEM || !NVMEM
252	depends on MFD_SYSCON
253	depends on OF
254	help
255	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
256	  It supports one critical trip point and one passive trip point.  The
257	  cpufreq is used as the cooling device to throttle CPUs when the
258	  passive trip is crossed.
259
260config IMX_SC_THERMAL
261	tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
262	depends on IMX_SCU
263	depends on OF
264	help
265	  Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
266	  system controller inside, Linux kernel has to communicate with system
267	  controller via MU (message unit) IPC to get temperature from thermal
268	  sensor. It supports one critical trip point and one
269	  passive trip point for each thermal sensor.
270
271config IMX8MM_THERMAL
272	tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
273	depends on ARCH_MXC || COMPILE_TEST
274	depends on OF
275	help
276	  Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
277	  It supports one critical trip point and one passive trip point. The
278	  cpufreq is used as the cooling device to throttle CPUs when the passive
279	  trip is crossed.
280
281config K3_THERMAL
282	tristate "Texas Instruments K3 thermal support"
283	depends on ARCH_K3 || COMPILE_TEST
284	help
285	  If you say yes here you get thermal support for the Texas Instruments
286	  K3 SoC family. The current chip supported is:
287	  - AM654
288
289	  This includes temperature reading functionality.
290
291config MAX77620_THERMAL
292	tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
293	depends on MFD_MAX77620
294	depends on OF
295	help
296	  Support for die junction temperature warning alarm for Maxim
297	  Semiconductor PMIC MAX77620 device. Device generates two alarm
298	  interrupts when PMIC die temperature cross the threshold of
299	  120 degC and 140 degC.
300
301config QORIQ_THERMAL
302	tristate "QorIQ Thermal Monitoring Unit"
303	depends on THERMAL_OF && HAS_IOMEM
304	depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
305	select REGMAP_MMIO
306	help
307	  Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
308	  It supports one critical trip point and one passive trip point. The
309	  cpufreq is used as the cooling device to throttle CPUs when the
310	  passive trip is crossed.
311
312config SPEAR_THERMAL
313	tristate "SPEAr thermal sensor driver"
314	depends on PLAT_SPEAR || COMPILE_TEST
315	depends on HAS_IOMEM
316	depends on OF
317	help
318	  Enable this to plug the SPEAr thermal sensor driver into the Linux
319	  thermal framework.
320
321config SUN8I_THERMAL
322	tristate "Allwinner sun8i thermal driver"
323	depends on ARCH_SUNXI || COMPILE_TEST
324	depends on HAS_IOMEM
325	depends on NVMEM
326	depends on OF
327	depends on RESET_CONTROLLER
328	help
329	  Support for the sun8i thermal sensor driver into the Linux thermal
330	  framework.
331
332	  To compile this driver as a module, choose M here: the
333	  module will be called sun8i-thermal.
334
335config ROCKCHIP_THERMAL
336	tristate "Rockchip thermal driver"
337	depends on ARCH_ROCKCHIP || COMPILE_TEST
338	depends on RESET_CONTROLLER
339	depends on HAS_IOMEM
340	help
341	  Rockchip thermal driver provides support for Temperature sensor
342	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
343	  trip point. Cpufreq is used as the cooling device and will throttle
344	  CPUs when the Temperature crosses the passive trip point.
345
346config RCAR_THERMAL
347	tristate "Renesas R-Car thermal driver"
348	depends on ARCH_RENESAS || COMPILE_TEST
349	depends on HAS_IOMEM
350	help
351	  Enable this to plug the R-Car thermal sensor driver into the Linux
352	  thermal framework.
353
354config RCAR_GEN3_THERMAL
355	tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
356	depends on ARCH_RENESAS || COMPILE_TEST
357	depends on HAS_IOMEM
358	depends on OF
359	help
360	  Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
361	  the Linux thermal framework.
362
363config RZG2L_THERMAL
364	tristate "Renesas RZ/G2L thermal driver"
365	depends on ARCH_RENESAS || COMPILE_TEST
366	depends on HAS_IOMEM
367	depends on OF
368	help
369	  Enable this to plug the RZ/G2L thermal sensor driver into the Linux
370	  thermal framework.
371
372config KIRKWOOD_THERMAL
373	tristate "Temperature sensor on Marvell Kirkwood SoCs"
374	depends on MACH_KIRKWOOD || COMPILE_TEST
375	depends on HAS_IOMEM
376	depends on OF
377	help
378	  Support for the Kirkwood thermal sensor driver into the Linux thermal
379	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
380
381config DOVE_THERMAL
382	tristate "Temperature sensor on Marvell Dove SoCs"
383	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
384	depends on HAS_IOMEM
385	depends on OF
386	help
387	  Support for the Dove thermal sensor driver in the Linux thermal
388	  framework.
389
390config DB8500_THERMAL
391	tristate "DB8500 thermal management"
392	depends on MFD_DB8500_PRCMU && OF
393	default y
394	help
395	  Adds DB8500 thermal management implementation according to the thermal
396	  management framework. A thermal zone with several trip points will be
397	  created. Cooling devices can be bound to the trip points to cool this
398	  thermal zone if trip points reached.
399
400config ARMADA_THERMAL
401	tristate "Marvell EBU Armada SoCs thermal management"
402	depends on ARCH_MVEBU || COMPILE_TEST
403	depends on HAS_IOMEM
404	depends on OF
405	help
406	  Enable this option if you want to have support for thermal management
407	  controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
408
409config DA9062_THERMAL
410	tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
411	depends on MFD_DA9062 || COMPILE_TEST
412	depends on OF
413	help
414	  Enable this for the Dialog Semiconductor thermal sensor driver.
415	  This will report PMIC junction over-temperature for one thermal trip
416	  zone.
417	  Compatible with the DA9062 and DA9061 PMICs.
418
419menu "Mediatek thermal drivers"
420depends on ARCH_MEDIATEK || COMPILE_TEST
421source "drivers/thermal/mediatek/Kconfig"
422endmenu
423
424config AMLOGIC_THERMAL
425	tristate "Amlogic Thermal Support"
426	default ARCH_MESON
427	depends on OF && ARCH_MESON
428	help
429	  If you say yes here you get support for Amlogic Thermal
430	  for G12 SoC Family.
431
432	  This driver can also be built as a module. If so, the module will
433	  be called amlogic_thermal.
434
435menu "Intel thermal drivers"
436depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
437source "drivers/thermal/intel/Kconfig"
438endmenu
439
440menu "Broadcom thermal drivers"
441depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
442		COMPILE_TEST
443source "drivers/thermal/broadcom/Kconfig"
444endmenu
445
446menu "Texas Instruments thermal drivers"
447depends on ARCH_HAS_BANDGAP || COMPILE_TEST
448depends on HAS_IOMEM
449source "drivers/thermal/ti-soc-thermal/Kconfig"
450endmenu
451
452menu "Samsung thermal drivers"
453depends on ARCH_EXYNOS || COMPILE_TEST
454source "drivers/thermal/samsung/Kconfig"
455endmenu
456
457menu "STMicroelectronics thermal drivers"
458depends on (ARCH_STI || ARCH_STM32) && OF
459source "drivers/thermal/st/Kconfig"
460endmenu
461
462source "drivers/thermal/tegra/Kconfig"
463
464config GENERIC_ADC_THERMAL
465	tristate "Generic ADC based thermal sensor"
466	depends on IIO
467	help
468	  This enabled a thermal sysfs driver for the temperature sensor
469	  which is connected to the General Purpose ADC. The ADC channel
470	  is read via IIO framework and the channel information is provided
471	  to this driver. This driver reports the temperature by reading ADC
472	  channel and converts it to temperature based on lookup table.
473
474menu "Qualcomm thermal drivers"
475depends on (ARCH_QCOM && OF) || COMPILE_TEST
476source "drivers/thermal/qcom/Kconfig"
477endmenu
478
479config UNIPHIER_THERMAL
480	tristate "Socionext UniPhier thermal driver"
481	depends on ARCH_UNIPHIER || COMPILE_TEST
482	depends on THERMAL_OF && MFD_SYSCON
483	help
484	  Enable this to plug in UniPhier on-chip PVT thermal driver into the
485	  thermal framework. The driver supports CPU thermal zone temperature
486	  reporting and a couple of trip points.
487
488config SPRD_THERMAL
489	tristate "Temperature sensor on Spreadtrum SoCs"
490	depends on ARCH_SPRD || COMPILE_TEST
491	help
492	  Support for the Spreadtrum thermal sensor driver in the Linux thermal
493	  framework.
494
495config KHADAS_MCU_FAN_THERMAL
496	tristate "Khadas MCU controller FAN cooling support"
497	depends on OF
498	depends on MFD_KHADAS_MCU
499	select MFD_CORE
500	select REGMAP
501	help
502	  If you say yes here you get support for the FAN controlled
503	  by the Microcontroller found on the Khadas VIM boards.
504
505config LOONGSON2_THERMAL
506	tristate "Loongson-2 SoC series thermal driver"
507	depends on LOONGARCH || COMPILE_TEST
508	depends on OF
509	help
510	  Support for Thermal driver found on Loongson-2 SoC series platforms.
511	  The thermal driver realizes get_temp and set_trips function, which
512	  are used to obtain the temperature of the current node and set the
513	  temperature range to trigger the interrupt. When the input temperature
514	  is higher than the high temperature threshold or lower than the low
515	  temperature threshold, the interrupt will occur.
516
517endif
518