thermal: Get rid of CONFIG_THERMAL_WRITABLE_TRIPS

The only difference made by CONFIG_THERMAL_WRITABLE_TRIPS is whether or
not the writable trips mask passed during thermal zone registration
will take any effect, but whoever passes a non-zero writable trips mask
to thermal_zone_device_register_with_trips() can be forgiven thinking
that it will always work.

Moreover, some thermal drivers expect user space to set trip temperature
values, so they select CONFIG_THERMAL_WRITABLE_TRIPS, possibly overriding
a manual choice to unset it and going against the design purportedly
allowing system integrators to decide on the writability of trip points
for the given kernel build. It is also set in one platform's defconfig.

Forthermore, CONFIG_THERMAL_WRITABLE_TRIPS only affects trip temperature,
because trip hysteresis is writable as long as the thermal zone provides
a callback to update it, regardless of the CONFIG_THERMAL_WRITABLE_TRIPS
value.

The above means that the symbol in question is used inconsistently and
its purpose is at least moot, so remove it and always take the writable
trip mask passed to thermal_zone_device_register_with_trips() into
account.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.

The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.

The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:

thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table

The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:

Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).

It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/loongson-2: Add thermal management support

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.

Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn>
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn

thermal: Allow selecting the bang-bang governor as default

For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.

The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.

Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/mediatek: Relocate driver to mediatek folder

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

thermal: Drop obsolete dependency on COMPILE_TEST

Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it
is possible to test-build any driver which depends on OF on any
architecture by explicitly selecting OF. Therefore depending on
COMPILE_TEST as an alternative is no longer needed.

It is actually better to always build such drivers with OF enabled,
so that the test builds are closer to how each driver will actually be
built on its intended target. Building them without OF may not test
much as the compiler will optimize out potentially large parts of the
code. In the worst case, this could even pop false positive warnings.
Dropping COMPILE_TEST here improves the quality of our testing and
avoids wasting time on non-existent issues.

Signed-off-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/governor: Remove deprecated information

The userspace governor is still in use on production systems and the
deprecating warning is scary.

Even if we want to get rid of the userspace governor, it is too soon
yet as the alternatives are not yet adopted.

Change the deprecated warning by an information message suggesting to
switch to the netlink thermal events.

Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/zx: Remove zx driver

The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org

thermal/drivers/tango: Remove tango driver

The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org

thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config

The rcar_gen3_thermal driver also supports RZ/G2 SoC's, update the
description to reflect this.

Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200917152141.30070-1-prabhakar.mahadev-lad.rj@bp.renesas.com

thermal: don't make THERMAL_NETLINK 'default y'

We just don't do that. "default y" is for things that are needed for
compatibility (when an old feature is made unconditional), or for things
that are basically part of the infrastructure of a platform.

And it can possibly be used for questions that don't enable code on
their own, but are used to enable or disable a whole slew of other
questions.

A new feature that people aren't using is never 'default y', unless it
cures cancer or ends world hunger.

Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>

thermal/drivers/clock_cooling: Remove clock_cooling code

clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/aa5d5ac2589cf7b14ece882130731b4a916849a6.1593619943.git.amit.kucheria@linaro.org

thermal: netlink: Fix compilation error when CONFIG_NET=n

When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.

As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.

Reported-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org

thermal: Add support for the MCU controlled FAN on Khadas boards

The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.

Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>

thermal: qoriq: Add platform dependencies

The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC
and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies
to the QORIQ_THERMAL config symbol, to avoid asking the user about it
when configuring a kernel without support for any of the aforementioned
SoCs.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Li Yang <leoyang.li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be

thermal: k3: Add support for bandgap sensors

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com

thermal: Add COMPILE_TEST support for i.MX8MM

Add COMPILE_TEST support to i.MX8MM thermal driver for better compile
testing coverage.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583509057-8197-1-git-send-email-Anson.Huang@nxp.com

thermal: qoriq: Fix a compiling issue

Qoriq thermal driver is used by both PowerPC and ARM architecture.
When built for PowerPC architecture, it reports error:
undefined reference to `.__devm_regmap_init_mmio_clk'
To fix it, select config REGMAP_MMIO.

Fixes: 4316237bd627 (thermal: qoriq: Convert driver to use regmap API)
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200303084641.35687-1-andy.tang@nxp.com

thermal: Remove COMPILE_TEST for IMX_SC_THERMAL

i.MX SCU thermal driver depends on IMX_SCU which does NOT have
COMPILE_TEST enabled, so need to remove COMPILE_TEST for i.MX
SCU thermal as well.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583222684-10229-2-git-send-email-Anson.Huang@nxp.com

thermal: Rephrase the Kconfig text for thermal

The thermal subsystem may have relied on sysfs in 2008 when it
was introduced, but these days the thermal zones will more often
than not come from the hardware descriptions and not from sysfs.

Drop the "Generic" phrases as well: there are no non-generic
drivers that I know of, the thermal framework is by definition
generic.

Reword a bit and fix some grammar.

[ Daniel Lezcano ] : fixed Randy's comment s/offers/offer/

Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200229204527.143796-1-linus.walleij@linaro.org

thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit

i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com

thermal: imx_sc: add i.MX system controller thermal support

i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..

This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com

thermal: sprd: Add Spreadtrum thermal driver support

This patch adds the support for Spreadtrum thermal sensor controller,
which can support maximum 8 sensors.

Signed-off-by: Freeman Liu <freeman.liu@unisoc.com>
Co-developed-with: Baolin Wang <baolin.wang@unisoc.com>
Signed-off-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com

thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40

This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com

thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver

The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org

thermal/drivers/Kconfig: Convert the CPU cooling device to a choice

The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.

There is no functional changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org

thermal: power_allocator: Fix Kconfig warning

When do randbuiding, we got this:

WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR
Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n]
Selected by [y]:
- THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && <choice>

The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the
THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL
which is not enabled.

Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR
to fix this warning.

Suggested-by: Quentin Perret <qperret@google.com>
Fixes: a4e893e802e6 ("thermal: cpu_cooling: Migrate to using the EM framework")
Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com

thermal: cpu_cooling: Migrate to using the EM framework

The newly introduced Energy Model framework manages power cost tables in
a generic way. Moreover, it supports several types of models since the
tables can come from DT or firmware (through SCMI) for example. On the
other hand, the cpu_cooling subsystem manages its own power cost tables
using only DT data.

In order to avoid the duplication of data in the kernel, and in order to
enable IPA with EMs coming from more than just DT, remove the private
tables from cpu_cooling.c and migrate it to using the centralized EM
framework. Doing so should have no visible functional impact for
existing users of IPA since:

- recent extenstions to the the PM_OPP infrastructure enable the
registration of EMs in PM_EM using the DT property used by IPA;

- the existing upstream cpufreq drivers marked with the
'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP
infrastructure, which means they all support PM_EM. The only two
exceptions are qoriq-cpufreq which doesn't in fact use an EM and
scmi-cpufreq which doesn't use DT for power costs.

For existing users of cpu_cooling, PM_EM tables will contain the exact
same power values that IPA used to compute on its own until now. The
only new dependency for them is to compile in CONFIG_ENERGY_MODEL.

The case where the thermal subsystem is used without an Energy Model
(cpufreq_cooling_ops) is handled by looking directly at CPUFreq's
frequency table which is already a dependency for cpu_cooling.c anyway.
Since the thermal framework expects the cooling states in a particular
order, bail out whenever the CPUFreq table is unsorted, since that is
fairly uncommon in general, and there are currently no users of
cpu_cooling for this use-case.

Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Quentin Perret <qperret@google.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com

thermal: amlogic: Add thermal driver to support G12 SoCs

Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).

The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.

Implement reading the temperature from each thermal sensor.

The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold

Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com

thermal: db8500: Finalize device tree conversion

At some point there was an attempt to convert the DB8500
thermal sensor to device tree: a probe path was added
and the device tree was augmented for the Snowball board.
The switchover was never completed: instead the thermal
devices came from from the PRCMU MFD device and the probe
on the Snowball was confused as another set of configuration
appeared from the device tree.

Move over to a device-tree only approach, as we fixed up
the device trees.

Cc: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

treewide: Add SPDX license identifier - Makefile/Kconfig

Add SPDX license identifiers to all Make/Kconfig files which:

- Have no license information of any form

These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:

GPL-2.0-only

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

thermal: Fix build error of missing devm_ioremap_resource on UM

The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:

drivers/thermal/thermal_mmio.o:
In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1):
undefined reference to `devm_ioremap_resource'

The users of devm_ioremap_resource() which are compile-testable
should depend on HAS_IOMEM.

Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Talel Shenhar <talel@amazon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Introduce Amazon's Annapurna Labs Thermal Driver

This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.

This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.

Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal/drivers/core: Fix typo in the option name

Unlike the other options, the cpu cooling option is beginning
with a lowercase letter, changing to a uppercase.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal/drivers/core: Remove depends on THERMAL in Kconfig

The dependency on the THERMAL option to be set is already there implicitly
by the "if THERMAL" conditionnal option. The sub Kconfigs do not have to
check against the THERMAL option as they are called from a Kconfig block
which is enabled by the conditionnal option.

Remove the useless "depends on THERMAL" in the Kconfigs.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal/drivers/core: Remove the module Kconfig's option

The module support for the thermal subsystem makes little sense:
- some subsystems relying on it are not modules, thus forcing the
framework to be compiled in
- it is compiled in for almost every configs, the remaining ones
are a few platforms where I don't see why we can not switch the thermal
to 'y'. The drivers can stay in tristate.
- platforms need the thermal to be ready as soon as possible at boot time
in order to mitigate

Usually the subsystems framework are compiled-in and the plugs are as
module.

Remove the module option. The removal of the module related dead code will
come after this patch gets in or is acked.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <groeck@chromium.org>
For mini2440:
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Paul Burton <paul.burton@mips.com> # MIPS part
Acked-by: Robert Jarzmik <robert.jarzmik@free.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: broadcom: Add Stingray thermal driver

Stingray SoC has six temperature sensor and those are
configured, controlled and accessed to read temperature
and update in DDR memory using m0 firmware.
All six sensors has been given 4 bytes of memory in DDR
to write temperature in millivolts.

This thermal driver read temperature values from DDR
because no direct access to sensors.
Like this all temparature sensors are monitored and
trips at critical temperature.

If driver can't handle thermal runaways because of
any unknown reason, then firmware in m0 Processor
will handle.

Reviewed-by: Ray Jui <ray.jui@broadcom.com>
Reviewed-by: Scott Branden <scott.branden@broadcom.com>
Reviewed-by: Vikram Prakash <vikram.prakash@broadcom.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com>
Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: cpu_cooling: Require thermal core to be compiled in

The CPU cooling driver (cpu_cooling.c) allows the platform's cpufreq
driver to register as a cooling device and cool down the platform by
throttling the CPU frequency. In order to be able to auto-register a
cpufreq driver as a cooling device from the cpufreq core, we need access
to code inside cpu_cooling.c which, in turn, accesses code inside
thermal core.

CPU_FREQ is a bool while THERMAL is tristate. In some configurations
(e.g. allmodconfig), CONFIG_THERMAL ends up as a module while
CONFIG_CPU_FREQ is compiled in. This leads to following error:

drivers/cpufreq/cpufreq.o: In function `cpufreq_offline':
cpufreq.c:(.text+0x407c): undefined reference to `cpufreq_cooling_unregister'
drivers/cpufreq/cpufreq.o: In function `cpufreq_online':
cpufreq.c:(.text+0x70c0): undefined reference to `of_cpufreq_cooling_register'

Given that platforms using CPU_THERMAL usually want it compiled-in so it
is available early in boot, make CPU_THERMAL depend on THERMAL being
compiled-in instead of allowing it to be a module.

As a result of this change, get rid of the ugly (!CPU_THERMAL ||
THERMAL) dependency in all cpufreq drivers using CPU_THERMAL.

Suggested-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: imx: fix for dependency on cpu-freq

The thermal driver is a standalone driver for monitoring SoC temperature
by enabling thermal sensor, so it can be enabled even when CONFIG_CPU_FREQ
is NOT set. So remove the dependency with CPU_THERMAL.

Introduce dummy function of legacy cooling register/unregister to make
thermal driver probe successfully when CONFIG_CPU_FREQ is NOT set.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

treewide: surround Kconfig file paths with double quotes

The Kconfig lexer supports special characters such as '.' and '/' in
the parameter context. In my understanding, the reason is just to
support bare file paths in the source statement.

I do not see a good reason to complicate Kconfig for the room of
ambiguity.

The majority of code already surrounds file paths with double quotes,
and it makes sense since file paths are constant string literals.

Make it treewide consistent now.

Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
Acked-by: Wolfram Sang <wsa@the-dreams.de>
Acked-by: Geert Uytterhoeven <geert@linux-m68k.org>
Acked-by: Ingo Molnar <mingo@kernel.org>

drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir

This cleans up the directory a bit allowing just one place to look for
thermal related drivers for QCOM platforms instead of being scattered in
the root directory and the qcom/ subdirectory. Compile-tested with
ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

drivers: thermal: Move various drivers for intel platforms into a subdir

This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add stm32 thermal driver

Add support for DTS thermal sensor that can be
found on some STM32 platforms.

This driver is based on OF and works in interrupt
mode.

It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.

Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number

The Intel SoC DTS uses a hardcoded GSI number, before this commit
it was passing it to request_irq as if it were a linux irq number,
but there is no 1:1 mapping so in essence it was requesting a
random interrupt.

Besides this causing the DTS driver to not actually get an interrupt
if the thermal thresholds are exceeded this also is causing an
interrupt conflict on some devices since the linux irq 86 which is
being requested is already in use, leading to oopses like this:

genirq: Flags mismatch irq 86. 00002001 (soc_dts) vs. 00000083 (volume_down)
CPU: 0 PID: 601 Comm: systemd-udevd Tainted: G C OE 4.17.0-rc6+ #45
Hardware name: Insyde i86/Type2 - Board Product Name, BIOS CHUWI.D86JLBNR03 01/14/2015
Call Trace:
dump_stack+0x5c/0x80
__setup_irq.cold.50+0x4e/0xac
? request_threaded_irq+0xad/0x160
request_threaded_irq+0xf5/0x160
? 0xffffffffc0a93000
intel_soc_thermal_init+0x74/0x1000 [intel_soc_dts_thermal]

This commit makes the intel_soc_dts_thermal.c code call
acpi_register_gsi() to translate the hardcoded IO-APIC GSI number (86)
to a linux irq, so that the dts code uses the right interrupt and we
no longer get an oops about an irq conflict.

Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add cooling device's statistics in sysfs

This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.

The write-only "reset" file is used to reset the statistics.

The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.

The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.

The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.

This is how the directory structure looks like for a single cooling
device:

$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state max_state power stats subsystem type uevent

/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms runtime_active_time runtime_suspended_time
control runtime_status

/sys/class/thermal/cooling_device0/stats:
reset time_in_state_ms total_trans trans_table

This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: armada: Update Kconfig and module description

Update Armada thermal driver Kconfig entry as well as the driver's
MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported,
eg. Armada 7K and Armada 8K.

Use the generic term "Marvell EBU Armada SoCs" instead of listing all
the supported SoCs everywhere (excepted in the Kconfig description,
where it is useful to have a list).

Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: add brcmstb AVS TMON driver

The AVS TMON core provides temperature readings, a pair of configurable
high- and low-temperature threshold interrupts, and an emergency
over-temperature chip reset. The driver utilizes the first two to
provide temperature readings and high-temperature notifications to
applications. The over-temperature reset is not exposed to
applications; this reset threshold is critical to the system and should
be set with care within the bootloader.

Applications may choose to utilize the notification mechanism, the
temperature reading mechanism (e.g., through polling), or both.

Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Signed-off-by: Doug Berger <opendmb@gmail.com>
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: enable broadcom menu for arm64 bcm2835

Moving the bcm2835 thermal driver to the broadcom directory prevented it
from getting enabled for arm64 builds, since the broadcom directory is only
available when 32-bit specific ARCH_BCM is set.

Fix this by enabling the Broadcom menu for ARCH_BCM or ARCH_BCM2835.

Fixes: 6892cf07e733 ("thermal: bcm2835: move to the broadcom subdirectory")
Reviewed-by: Eric Anholt <eric@anholt.net>
Signed-off-by: Allen Wild <allenwild93@gmail.com>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: imx: add NVMEM dependency

The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable
module:

drivers/thermal/imx_thermal.o: In function `imx_thermal_probe':
imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'

This adds a Kconfig dependency to force it to be a module as well
when its dependency is loadable.

Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: uniphier: add UniPhier thermal driver

Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: fix INTEL_SOC_DTS_IOSF_CORE dependencies

We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:

warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)

This adds a new depedency.

Fixes: 3a2419f865a6 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: core: Add a back up thermal shutdown mechanism

orderly_poweroff is triggered when a graceful shutdown
of system is desired. This may be used in many critical states of the
kernel such as when subsystems detects conditions such as critical
temperature conditions. However, in certain conditions in system
boot up sequences like those in the middle of driver probes being
initiated, userspace will be unable to power off the system in a clean
manner and leaves the system in a critical state. In cases like these,
the /sbin/poweroff will return success (having forked off to attempt
powering off the system. However, the system overall will fail to
completely poweroff (since other modules will be probed) and the system
is still functional with no userspace (since that would have shut itself
off).

However, there is no clean way of detecting such failure of userspace
powering off the system. In such scenarios, it is necessary for a backup
workqueue to be able to force a shutdown of the system when orderly
shutdown is not successful after a configurable time period.

Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

mfd: intel_soc_pmic: Fix a mess with compilation units

Crystal Cove and Whiskey Cove are two different PMICs which are
installed on Intel Atom SoC based platforms.

Moreover there are two independent drivers that by some reason were
supposed (*) to get into one kernel module.

Fix the mess by clarifying Kconfig option for Crystal Cove and split
Whiskey Cove out of it.

(*) It looks like the configuration was never tested with
INTEL_SOC_PMIC=n. The line in Makefile is actually wrong.

Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI)
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>

thermal: bcm2835: move to the broadcom subdirectory

We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.

Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: da9062/61: Thermal junction temperature monitoring driver

Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.

If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.

The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).

This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.

When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.

This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: broadcom: add Northstar thermal driver

Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: bcm2835: add thermal driver for bcm2835 SoC

Add basic thermal driver for bcm2835 SoC.

This driver currently make sure that tsense HW block is set up
correctly.

Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

cpufreq: dbx500: Manage cooling device from cpufreq driver

The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.

The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.

Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: zx2967: add thermal driver for ZTE's zx2967 family

This patch adds thermal driver for ZTE's zx2967 family.

Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver

Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.

Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: hisilicon: fix for dependency

The thermal driver is standalone driver which is used to enable
thermal sensors, so it can be used with any cooling device and
should not bind with CPU cooling device driver.

This original patch is suggested by Amit Kucheria; so it's to
polish the dependency in Kconfig, and remove the dependency with
CPU_THERMAL.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: max77620: Add thermal driver for reporting junction temp

Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: imx: depend on imx SoC arch

Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.

v2: drop extraneous OF

Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: qoriq: Add thermal management support

This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.

Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: qcom: tsens: Add a skeletal TSENS drivers

TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add Intel BXT WhiskeyCove PMIC thermal driver

This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.

Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: generic-adc: Add ADC based thermal sensor driver

In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.

Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: add temperature sensor support for tango SoC

The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.

Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: tegra: move tegra thermal files into tegra directory

Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal / ACPI / video: add INT3406 thermal driver

INT3406 ACPI device object resembles an ACPI video output device, but its
_BCM is said to be deprecated and should not be used. So we will make
use of the raw interface to do the actual cooling.

Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: fix Mediatek thermal controller build

At least with CONFIG_COMPILE_TEST, there's no reason to assume
that CONFIG_RESET_CONTROLLER is set, but the code for this
controller requires it since it calls device_reset().

Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER.

Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: fix mtk_thermal build dependency

Fix build errors when MTK_THERMAL=y and NVMEM=m by preventing that
Kconfig combination.

drivers/built-in.o: In function `mtk_thermal_probe':
mtk_thermal.c:(.text+0xffa8f): undefined reference to `nvmem_cell_get'
mtk_thermal.c:(.text+0xffabe): undefined reference to `nvmem_cell_read'
mtk_thermal.c:(.text+0xffac9): undefined reference to `nvmem_cell_put'

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: <linux-pm@vger.kernel.org>
Cc: Sascha Hauer <s.hauer@pengutronix.de>
Cc: Hanyi Wu <hanyi.wu@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: mtk: allow compile testing on UM

Following the fix on thermal Kconfig, this
patch adds dependency on HAS_IOMEM so driver
properly compile test on UM arch.

Cc: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthias Brugger <matthias.bgg@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-mediatek@lists.infradead.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Fix build error of missing devm_ioremap_resource on UM

The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:

drivers/built-in.o: In function `kirkwood_thermal_probe':
kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource'
drivers/built-in.o: In function `exynos_tmu_probe':
exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap'

The users of devm_ioremap_resource() which are compile-testable should
depend on HAS_IOMEM.

Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar: Use ARCH_RENESAS

Make use of ARCH_RENESAS in place of ARCH_SHMOBILE.

This is part of an ongoing process to migrate from ARCH_SHMOBILE to
ARCH_RENESAS the motivation for which being that RENESAS seems to be a more
appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs.

Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: db8500_cpufreq_cooling: Compile with COMPILE_TEST

This driver only has runtime but no build time dependencies, so it can be
built for testing purposes if the Kconfig COMPILE_TEST option is enabled.

This is useful to have more build coverage and make sure that drivers are
not affected by changes that could cause build regressions.

Signed-off-by: Luis de Bethencourt <luisbg@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add Mediatek thermal controller support

This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: allow u8500-thermal driver to be a module

When the thermal subsystem is a loadable module, the u8500 driver
fails to build:

drivers/thermal/built-in.o: In function `db8500_thermal_probe':
db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register'
drivers/thermal/built-in.o: In function `db8500_thermal_work':
db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update'

This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: allow spear-thermal driver to be a module

When the thermal subsystem is a loadable module, the spear driver
fails to build:

drivers/thermal/built-in.o: In function `spear_thermal_exit':
spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister'
drivers/thermal/built-in.o: In function `spear_thermal_probe':
spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register'

This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Revert "thermal: qcom_spmi: allow compile test"

This just caused build errors:

warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
:(.text+0x609b0): undefined reference to `spmi_ext_register_write'
:(.text+0x609f0): undefined reference to `spmi_ext_register_writel'

While it's generally a good idea to allow compile testing, in this
case, it just doesn't work, so reverting the patch that
introduced the compile-test variant seems the most appropriate
solution.

Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
statement, so we should be able to enable SPMI on all architectures
for compile testing already.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: cb7fb4d34202 ("thermal: qcom_spmi: allow compile test")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add devfreq cooling

Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq. In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermal

After the commit "thermal: core: Add Kconfig option to enable writable
trips", by default the trips are read only. This cause user space thermal
controllers to poll for temperature as they can't set temperature
thresholds for getting a notification via uevents. These programs use RW
trip in a zone to register thresholds. Since we need to enable the new
config introduced by above commit to allow writable trips, selecting
CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

thermal: ti-soc: Kconfig fix to avoid menu showing wrongly

Move the dependencies to menu, so we avoid showing it wrongly.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-omap@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: qcom_spmi: allow compile test

Adding COMPILE_TEST flag to qcom_spmi driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: exynos: allow compile test

Adding COMPILE_TEST flag to exynos driver to facilitate
maintenance.

Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: armada: allow compile test

Adding COMPILE_TEST flag to armada driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: dove: allow compile test

Adding COMPILE_TEST flag to dove driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: kirkwood: allow compile test

Adding COMPILE_TEST flag to kirkwood driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rockchip: allow compile test

Adding COMPILE_TEST flag to rockchip driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-rockchip@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: spear: allow compile test

Adding COMPILE_TEST flag to spear driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: hisi: allow compile test

Adding COMPILE_TEST flag to hisi driver to facilitate maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add Intel PCH thermal driver

This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.

Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: hisilicon: add new hisilicon thermal sensor driver

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: remove stale THERMAL_POWER_ACTOR select

A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped. Remove the select as it is not doing anything.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: core: Add Kconfig option to enable writable trips

Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.

The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: introduce the Power Allocator governor

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add QPNP PMIC temperature alarm driver

Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: intel Quark SoC X1000 DTS thermal driver

In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
- to read DTS temperature
$ cat temp
- to read critical trip point
$ cat trip_point_0_temp
- to read trip point type
$ cat trip_point_0_type
- to emulate temperature raise to test orderly shutdown by Linux distro
$ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal/int340x/processor_thermal: Enable auxiliary DTS for Braswell

Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

Thermal: Intel SoC: DTS thermal use common APIs

There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

Thermal: Intel SoC: DTS thermal IOSF core

This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

thermal: rockchip: add driver for thermal

Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add Tegra SOCTHERM thermal management driver

This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: introduce clock cooling device

This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal: int340x thermal: select ACPI fan driver

we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: int340x_thermal: expose acpi thermal relationship tables

ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.

This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.

The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.

Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: introduce int3403 thermal driver

ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.

Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: int3400 thermal: register to thermal framework

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: introduce int3400 thermal driver

Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

ACPI: introduce ACPI int340x thermal scan handler

Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.

This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Remove ARCH_KIRKWOOD dependency

mach-kirkwood has been removed, now that kirkwood lives in mach-mvebu.
Depend on MACH_KIRKWOOD, which will be set when kirkwood is built as
part of ARCH_MVEBU.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Link: https://lkml.kernel.org/r/1409417172-6846-4-git-send-email-andrew@lunn.ch
Signed-off-by: Jason Cooper <jason@lakedaemon.net>

thermal: Added Bang-bang thermal governor

The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device. It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only. For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: allow building dove_thermal with mvebu

DT-enabled Dove has moved from ARCH_DOVE in mach-dove to MACH_DOVE
in mach-mvebu. As non-DT ARCH_DOVE will stay to rot for a while, add a new
DT-only MACH_DOVE to thermal Kconfig.

This was originally supposed to go in via "ARM: dove: prepare new Dove DT Kconfig"
patch from Sebastian Hesselbarth for 3.15, but slipped through the cracks.

I've tested on CuBox that without this patch you can't compile
dove_thermal into a mach-mvebu based kernel, and with this patch I can
build the driver and it works as expected run-time.

v2: non-ascii char creeped in somehow

Signed-off-by: Riku Voipio <riku.voipio@linaro.org>
Cc: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: sti: Introduce ST Thermal core code

This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.

Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Intel SoC DTS thermal

In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: offer Samsung thermal support only when ARCH_EXYNOS is defined

Menu for Samsung thermal support is visible on all Samsung
platforms while thermal drivers are currently available only
for EXYNOS SoCs. Fix it by replacing PLAT_SAMSUNG dependency
with ARCH_EXYNOS one.

Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal,rcar_thermal: Add dependency on HAS_IOMEM

Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.

On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.

drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'

Signed-off-by: Richard Weinberger <richard@nod.at>
Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: update INT3404 thermal driver help text

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

drivers: Enable building of Kirkwood drivers for mach-mvebu

With the move of kirkwood into mach-mvebu, drivers Kconfig need
tweeking to allow the kirkwood specific drivers to be built.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mark Brown <broonie@linaro.org>
Acked-by: Kishon Vijay Abraham I <kishon@ti.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Jason Gunthorpe <jgunthorpe@obsidianresearch.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Richard Purdie <rpurdie@rpsys.net>
Cc: Bryan Wu <cooloney@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Jason Cooper <jason@lakedaemon.net>

thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST

This helps increasing build testing coverage.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Acked-by: Simon Horman <horms@verge.net.au>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: ACPI INT3403 thermal driver

The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: cpu_cooling: introduce of_cpufreq_cooling_register

This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: introduce device tree parser

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

cpufreq: remove CONFIG_CPU_FREQ_TABLE

CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as
cpufreq core depends on it. So, we don't need this CONFIG option anymore as it
is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: Kconfig: cosmetic fixes

Fix typo, finish sentence and add missing dots.

Signed-off-by: Luka Perkov <luka@openwrt.org>
CC: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

typo in drivers/thermal/Kconfig: lpatform instead of platform

Applied to the HEAD of linux.git,
VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0
Signed-off-by: Regid Ichira <regid23@nt1.in>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: hwmon: move hwmon support to single file

In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: exynos: Moving exynos thermal files into samsung directory

This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: add imx thermal driver support

This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid). Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs. The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: fix x86_pkg_temp_thermal.c build and Kconfig

Fix build error in x86_pkg_temp_thermal.c. It requires that
X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol,
since it depends on X86_MCE (indirectly).

Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block,
so remove that duplicated dependency.

ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: CPU Package temperature thermal

This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: introduce TI SoC thermal driver

This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: cpu_cooling: update Kconfig entry

There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: build cpu_cooling code into thermal_sys module

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>

thermal: add a warning for temperature emulation feature

Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: exynos: Adapt to temperature emulation core thermal framework

This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.

In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add driver for Armada 370/XP SoC thermal management

This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: rename thermal governor Kconfig option to avoid generic naming

Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Dove: Add Themal sensor support for Dove.

The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add support for the thermal sensor on Kirkwood SoCs

This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation

This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

PM: Introduce Intel PowerClamp Driver

Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: exynos: Add sysfs node supporting exynos's emulation mode.

This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

treewide: Fix typos in various Kconfig

Correct spelling typo within various Kconfig.

Signed-off-by: Masanari Iida <standby24x7@gmail.com>
Signed-off-by: Jiri Kosina <jkosina@suse.cz>

thermal: cpu cooling: allow module builds

As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add ST-Ericsson DB8500 thermal driver.

This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically. The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Exynos: Add missing dependency

CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking
for dependencies gives the following compilation warnings:
warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 &&
CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet
direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ)

Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Refactor drivers/thermal/Kconfig

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Provide option to choose default thermal governor

This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add a thermal notifier for user space

This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Introduce a step_wise thermal governor

This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Introduce fair_share thermal governor

This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured

Commit 023614183768 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

drivers/built-in.o: In function `cpufreq_get_max_state':
drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
drivers/built-in.o: In function `get_cpu_frequency':
drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.

Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>

thermal: exynos5: add exynos5250 thermal sensor driver support

Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

hwmon: exynos4: move thermal sensor driver to driver/thermal directory

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add generic cpufreq cooling implementation

This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:

* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,

a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
| |
\|/ |
Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add Renesas R-Car thermal sensor support

This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

drivers/thermal/spear_thermal.c: add Device Tree probing capability

SPEAr platforms now support DT and so must convert all drivers to support
DT. This patch adds DT probing support for SPEAr thermal sensor driver
and updates its documentation too.

Also, as SPEAr is the only user of this driver and is only available with
DT, make this an only DT driver. So, platform_data is completely removed
and passed via DT now.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Cc: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add support for thermal sensor present on SPEAr13xx machines

ST's SPEAr13xx machines are based on CortexA9 ARM processors. These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: hide CONFIG_THERMAL_HWMON

It's about time to revert 16d752397301b9 ("thermal: Create
CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also
be running a recent enough version of lm-sensors.

Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of
dropping it, we keep it but hide it.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>

ACPI: Fix build for CONFIG_NET unset

Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>

thermal: Add event notification to thermal framework

This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.

Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add missing Kconfig dependency

Otherwise THERMAL_HWMON can be selected when HWMON=n and THERMAL=n, which
fails to build.

Signed-off-by: Jan Beulich <jbeulich@novell.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: Create CONFIG_THERMAL_HWMON=n

A bug in libsensors <= 2.10.6 is exposed
when this new hwmon I/F is enabled.
Create CONFIG_THERMAL_HWMON=n
until some time after libsensors 2.10.7 ships
so those users can run the latest kernel.

libsensors 3.x is already fixed -- those users
can use CONFIG_THERMAL_HWMON=y now.

Signed-off-by: Rene Herman <rene.herman@gmail.com>
Acked-by: Mark M. Hoffman <mhoffman@lightlink.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add the support for building the generic thermal as a module

Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: delete "default y"

The generic thermal I/F gets selected by ACPI_THERMAL --
its only current customer.
it doesn't need to clutter other configs by default.

Signed-off-by: Len Brown <len.brown@intel.com>

Revert "thermal: fix generic thermal I/F for hwmon"

This reverts commit 3152fb9f11cdd2fd8688c2c5cb805e5c09b53dd9.

This broke libsensors.

Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: fix generic thermal I/F for hwmon

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

ACPI: thermal: syntax, spelling, kernel-doc

Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com>
Signed-off-by: Len Brown <len.brown@intel.com>

the generic thermal sysfs driver

The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>