thermal/tools/tmon: Fix typo 'the the' in comment

Replace 'the the' with 'the' in the comment.

Signed-off-by: Slark Xiao <slark_xiao@163.com>
Link: https://lore.kernel.org/r/20220722104047.83312-1-slark_xiao@163.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: tools: tmon: remove unneeded local variable

Fix the following coccicheck review:
/tools/thermal/tmon/pid.c:57:5-8: Unneeded variable

Remove unneeded variable used to store return value.

Reported-by: Zeal Robot <zealci@zte.com.cn>
Signed-off-by: ran jianping <ran.jianping@zte.com.cn>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 89

Based on 1 normalized pattern(s):

this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 or
later as published by the free software foundation this program is
distributed in the hope that it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details

extracted by the scancode license scanner the SPDX license identifier

GPL-2.0-or-later

has been chosen to replace the boilerplate/reference in 6 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Richard Fontana <rfontana@redhat.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190520075211.856638608@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

tools/thermal: Introduce tmon, a tool for thermal subsystem

Increasingly, Linux is running on thermally constrained devices. The simple
thermal relationship between processor and fan has become past for modern
computers.

As hardware vendors cope with the thermal constraints on their products,
more sensors are added, new cooling capabilities are introduced. The
complexity of the thermal relationship can grow exponentially among cooling
devices, zones, sensors, and trip points. They can also change dynamically.

To expose such relationship to the userspace, Linux generic thermal layer
introduced sysfs entry at /sys/class/thermal with a matrix of symbolic
links, trip point bindings, and device instances. To traverse such
matrix by hand is not a trivial task. Testing is also difficult in that
thermal conditions are often exception cases that hard to reach in
normal operations.

TMON is conceived as a tool to help visualize, tune, and test the
complex thermal subsystem.

Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>