History log of /linux-master/include/sound/rt5663.h
Revision Date Author Comments
# d2912cb1 04-Jun-2019 Thomas Gleixner <tglx@linutronix.de>

treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 500

Based on 2 normalized pattern(s):

this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
published by the free software foundation

this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
published by the free software foundation #

extracted by the scancode license scanner the SPDX license identifier

GPL-2.0-only

has been chosen to replace the boilerplate/reference in 4122 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Enrico Weigelt <info@metux.net>
Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190604081206.933168790@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>


# 457c25ef 18-Sep-2017 Oder Chiou <oder_chiou@realtek.com>

ASoC: rt5663: Add the function of impedance sensing

Support the function of impedance sensing. It could be set the matrix row
number of the impedance sensing table and the related parameters in the
DTS.

Signed-off-by: Oder Chiou <oder_chiou@realtek.com>
Signed-off-by: Mark Brown <broonie@kernel.org>


# 278982b5 02-Aug-2017 oder_chiou@realtek.com <oder_chiou@realtek.com>

ASoC: rt5663: Seprate the DC offset between headphone and headset

The patch seprates the DC offset between headphone and headset.

Signed-off-by: Oder Chiou <oder_chiou@realtek.com>
Signed-off-by: Mark Brown <broonie@kernel.org>


# 450f0f6a 09-Jul-2017 oder_chiou@realtek.com <oder_chiou@realtek.com>

ASoC: rt5663: Add the manual offset field to compensate the DC offset

The patch adds the manual offset field in the devicetree to compensate the
DC offset that will be different between the PCB layout. It only can be
measured by the real production.

Signed-off-by: Oder Chiou <oder_chiou@realtek.com>
Signed-off-by: Mark Brown <broonie@kernel.org>