thermal: Constify the trip argument of the .get_trend() zone callback

Add 'const' to the definition of the 'trip' argument of the
.get_trend() thermal zone callback to indicate that the trip point
passed to it should not be modified by it and adjust the
callback functions implementing it, thermal_get_trend() in the
ACPI thermal driver and __ti_thermal_get_trend(), accordingly.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Michal Wilczynski <michal.wilczynski@intel.com>

thermal: core: Rework .get_trend() thermal zone callback

Passing a struct thermal_trip pointer instead of a trip index to the
.get_trend() thermal zone callback allows one of its 2 implementations,
the thermal_get_trend() function in the ACPI thermal driver, to be
simplified quite a bit, and the other implementation of it in the
ti-soc-thermal driver does not even use the relevant callback argument.

For this reason, change the .get_trend() thermal zone callback
definition and adjust the related code accordingly.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor()

The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.

Signed-off-by: Yangtao Li <frank.li@vivo.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-8-frank.li@vivo.com

thermal/drivers/ti: Use fixed update interval

Currently the TI thermal driver sets the sensor update interval based
on the polling of the thermal zone. In order to get the polling rate,
the code inspects the thermal zone device structure internals, thus
breaking the self-encapsulation of the thermal framework core
framework.

On the other side, we see the common polling rates set in the device
tree for the platforms using this driver are 500 or 1000 ms.

Setting the polling rate to 250 ms would be far enough to cover the
combination we found in the device tree.

Instead of accessing the thermal zone device structure polling rate,
let's use a common update interval of 250 ms for the driver.

Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20230307133735.90772-7-daniel.lezcano@linaro.org

thermal: Use of_property_present() for testing DT property presence

It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.

Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: Use thermal_zone_device_type() accessor

Replace the accesses to 'tz->type' by its accessor version in order to
self-encapsulate the thermal_zone_device structure.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: Don't use 'device' internal thermal zone structure field

Some drivers are directly using the thermal zone's 'device' structure
field.

Use the driver device pointer instead of the thermal zone device when
it is available.

Remove the traces when they are duplicate with the traces in the core
code.

Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek LVTS
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()

The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.

Actually, it uses the tz->device to add it in the devres list.

It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers

The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/ti-soc: Switch to new of API

The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.

Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-25-daniel.lezcano@linexp.org
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/ti-soc-thermal: Remove unused function ti_thermal_get_temp()

commit b263b473bf62 ("thermal: ti-soc-thermal: Remove redundant code")
left behind this, remove it.

Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Reviewed-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20220305125047.26948-1-yuehaibing@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

drivers/thermal/ti-soc-thermal: Add hwmon support

Expose ti-soc-thermal thermal sensors as HWMON devices.

# sensors
cpu_thermal-virtual-0
Adapter: Virtual device
temp1: +54.2 C (crit = +105.0 C)

dspeve_thermal-virtual-0
Adapter: Virtual device
temp1: +51.4 C (crit = +105.0 C)

gpu_thermal-virtual-0
Adapter: Virtual device
temp1: +54.2 C (crit = +105.0 C)

iva_thermal-virtual-0
Adapter: Virtual device
temp1: +54.6 C (crit = +105.0 C)

core_thermal-virtual-0
Adapter: Virtual device
temp1: +52.6 C (crit = +105.0 C)

Similar to imx_sc_thermal d2bc4dd91da6095a769fdc9bc519d3be7ad5f97a.

No need to take care of thermal_remove_hwmon_sysfs() since
devm_thermal_add_hwmon_sysfs() (a wrapper around devres) is
used. See c7fc403e40b0ea18976a59e968c23439a80809e8.

Signed-off-by: Romain Naour <romain.naour@smile.fr>
Link: https://lore.kernel.org/r/20220218104725.2718904-1-romain.naour@smile.fr
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/core: Remove ms based delay fields

The code does no longer use the ms unit based fields to set the
delays as they are replaced by the jiffies.

Remove them and replace their user to use the jiffies version instead.

Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Peter Kästle <peter@piie.net>
Acked-by: Hans de Goede <hdegoede@redhat.com>
Link: https://lore.kernel.org/r/20201216220337.839878-3-daniel.lezcano@linaro.org

thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor()

This condition is reversed and will cause breakage.

Fixes: 7440f518dad9 ("thermal/drivers/ti-soc-thermal: Avoid dereferencing ERR_PTR")
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200616091949.GA11940@mwanda

thermal/drivers/ti-soc-thermal: Avoid dereferencing ERR_PTR

On error the function ti_bandgap_get_sensor_data() returns the error
code in ERR_PTR() but we only checked if the return value is NULL or
not. And, so we can dereference an error code inside ERR_PTR.
While at it, convert a check to IS_ERR_OR_NULL.

Signed-off-by: Sudip Mukherjee <sudipm.mukherjee@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200424161944.6044-1-sudipm.mukherjee@gmail.com

treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 336

Based on 1 normalized pattern(s):

this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
published by the free software foundation this program is
distributed in the hope that it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details you should have received a copy of the gnu general
public license along with this program if not write to the free
software foundation inc 51 franklin st fifth floor boston ma 02110
1301 usa

extracted by the scancode license scanner the SPDX license identifier

GPL-2.0-only

has been chosen to replace the boilerplate/reference in 246 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000436.674189849@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

thermal: ti-soc-thermal: Fix ti_thermal_unregister_cpu_cooling NULL pointer on unload

While debugging some PM issues and trying to remove all the loaded modules, I ran
across the following when unloading ti-soc-thermal:

Unable to handle kernel NULL pointer dereference at virtual address 000000b4
...
[<c08db340>] (kobject_put) from [<bf28954c>] (ti_thermal_unregister_cpu_cooling+0x20/0x28 [ti_soc_thermal])
[<bf28954c>] (ti_thermal_unregister_cpu_cooling [ti_soc_thermal]) from [<bf287c88>] (ti_bandgap_remove+0x3c/0x104 [ti_soc_thermal])
[<bf287c88>] (ti_bandgap_remove [ti_soc_thermal]) from [<c0610d48>] (platform_drv_remove+0x24/0x3c)
[<c0610d48>] (platform_drv_remove) from [<c060f114>] (device_release_driver_internal+0x160/0x208)
[<c060f114>] (device_release_driver_internal) from [<c060f200>] (driver_detach+0x38/0x6c)
[<c060f200>] (driver_detach) from [<c060e2d4>] (bus_remove_driver+0x4c/0xa0)
[<c060e2d4>] (bus_remove_driver) from [<c01f2370>] (SyS_delete_module+0x168/0x238)
[<c01f2370>] (SyS_delete_module) from [<c0108240>] (ret_fast_syscall+0x0/0x28)

Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: cpu_cooling: use cpufreq_policy to register cooling device

The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the
frequency table, etc. Most of the callers of CPU cooling driver's
registration routines have the cpufreq policy with them, but they only
pass the policy->related_cpus cpumask. The __cpufreq_cooling_register()
routine then gets the policy by itself and uses it.

It would be much better if the callers can pass the policy instead
directly. This also fixes a basic design flaw, where the policy can be
freed while the CPU cooling driver is still active.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: ti-soc-thermal: Remove redundant code

ti_thermal_expose_sensor always takes the
devm_thermal_zone_of_sensor_register call for registration
with the device tree nodes present for all the bandgap sensors
for omap3/4/5 and dra7 family. There are large chunks of unused
code. Removing all of them.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: ti-soc-thermal: Fetch slope and offset from DT

Currently slope and offset values for calculating the hot spot
temperature of a thermal zone is being taken directly from driver
data. So fetch them from device tree.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Enhance thermal_zone_device_update for events

Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: streamline get_trend callbacks

The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);

Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.

While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: convert ti-thermal to use devm_thermal_zone_of_sensor_register

This changes the driver to use the devm_ version
of thermal_zone_of_sensor_register and cleans
up the local points and unregister calls.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-omap@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Tested-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: consistently use int for temperatures

The thermal code uses int, long and unsigned long for temperatures
in different places.

Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.

'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.

Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

cleanup ti-soc-thermal

Simplify code by removing goto's where they point to simple return.

Avoid confusing |= on error values.

Correct whitespace.

Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: of: fix cooling device weights in device tree

Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

ti-soc-thermal: Delete an unnecessary check before the function call "cpufreq_cooling_unregister"

The cpufreq_cooling_unregister() function tests whether its argument is NULL
and then returns immediately. Thus the test around the call is not needed.

This issue was detected by using the Coccinelle software.

Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: ti-soc-thermal: Do not print error message in the EPROBE_DEFER case

Avoid printing the error message in the EPROBE_DEFER case
where registering cpu cooling at ti-soc-thermal thermal driver.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: cpu_cooling: check for the readiness of cpufreq layer

In this patch, the cpu_cooling code checks for the usability of cpufreq
layer before proceeding with the CPU cooling device registration. The
main reason is: CPU cooling device is not usable if cpufreq cannot
switch frequencies.

Similar checks are spread in thermal drivers. Thus, the advantage now
is to have the check in a single place: cpu cooling device registration.
For this reason, this patch also updates the existing drivers that
depend on CPU cooling to simply propagate the error code of the cpu
cooling registration call. Therefore, in case cpufreq is not ready, the
thermal drivers will still return -EPROBE_DEFER, in an attempt to try
again when cpufreq layer gets ready.

Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: of: improve of-thermal sensor registration API

Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.

The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.

This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.

Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Alexandre Courbot <acourbot@nvidia.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: ti-soc-thermal: use thermal DT infrastructure

This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.

The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.

In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

drivers: thermal: allow ti-soc-thermal run without pcb zone

This patch changes the behavior of TI SoC thermal driver
when there is a PCB thermal zone.

Instead of reporting an error code when reading from
PCB temperature sensor fails, this patch will make
the driver attempt to compose the hotspot extrapolation
based on bandgap readings only.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: ti-soc-thermal: Set the bandgap mask counter delay value

Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL

This patch changes the driver to avoid the usage of IS_ERR_OR_NULL()
macro. This macro can lead to dangerous results, like returning
success (0) during a failure scenario (NULL pointer handling).

For this reason this patch is changing the driver after
revisiting the code. These are the cases:
i. For cases in which IS_ERR_OR_NULL() is used for checking
return values of functions that returns either PTR_ERR()
or a valid pointer, it has been translated to IS_ERR() check only.
ii. For cases that a NULL check is still needed, it has been
translated to if (!ptr || IS_ERR(ptr)).

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: ti-soc-thermal: remove external heat while extrapolating hotspot

For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: introduce TI SoC thermal driver

This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>