treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 282

Based on 1 normalized pattern(s):

this software is licensed under the terms of the gnu general public
license version 2 as published by the free software foundation and
may be copied distributed and modified under those terms this
program is distributed in the hope that it will be useful but
without any warranty without even the implied warranty of
merchantability or fitness for a particular purpose see the gnu
general public license for more details

extracted by the scancode license scanner the SPDX license identifier

GPL-2.0-only

has been chosen to replace the boilerplate/reference in 285 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190529141900.642774971@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

thermal: ti-soc-thermal: remove dead code

Majority of this code (i.e. functions from ti-bandgap.c) has been
introduced in May 2013 by commit eb982001dbd8 ("thermal: introduce TI
SoC thermal driver"). Just remove it altogether (in case it is needed
it can be easily resurrected from git repo).

While at it fix incorrect "not used" comments.

Tested-by: Keerthy <j-keerthy@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: ti-soc-thermal: Remove redundant constants

Now that slope and offset data are being passed from
device tree no need to populate in driver data.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: ti-soc-thermal: add OMAP36xx support

Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf

Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

ti-soc-thermal: implement omap3 support

This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.

Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>