thermal: rzg2l: Convert to platform remove callback returning void

The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.

To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().

Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: Explicitly include correct DT includes

The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.

Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()

The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().

Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.

Remove the call and again prevent the drivers to access the thermal
internals.

Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers

The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/rzg2l: Switch to new of API

The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.

Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-19-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/rzg2l: Fix comments

This patch replaces 'Capture times'->'Total number of ADC data samples' as
the former does not really explain much.

It also fixes the typo
* caliberation->calibration

Lastly, as per the coding style /* should be on a separate line.
This patch fixes this issue.

Reported-by: Pavel Machek <pavel@denx.de>
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20220718121440.556408-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/rz2gl: Fix OTP Calibration Register values

As per the latest RZ/G2L Hardware User's Manual (Rev.1.10 Apr, 2022),
the bit 31 of TSU OTP Calibration Register(OTPTSUTRIM) indicates
whether bit [11:0] of OTPTSUTRIM is valid or invalid.

This patch updates the code to reflect this change.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220428093346.7552-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/rz2gl: Add error check for reset_control_deassert()

If reset_control_deassert() fails, then we won't be able to access
the device registers. Therefore check the return code of
reset_control_deassert() and bail out in case of error.

While at it replace the parameter "&pdev->dev" -> "dev" in
devm_reset_control_get_exclusive().

Suggested-by: Philipp Zabel <p.zabel@pengutronix.de>
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Philipp Zabel <p.zabel@pengutronix.de>
Link: https://lore.kernel.org/r/20211208164010.4130-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>