thermal/drivers/rcar_gen3: Add support for R-Car V4M

Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4M (R8A779H0) SoC.

The conversion formulas for R-Car V4M are the same as for other R-Car
Gen4 SoCs.

Based on a patch in the BSP by Duy Nguyen.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/bd5b002a802c1e058e0048592f17862db1d04263.1709722342.git.geert+renesas@glider.be

thermal: rcar_gen3: Convert to platform remove callback returning void

The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.

To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().

Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: Explicitly include correct DT includes

The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.

Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

drivers/thermal/rcar_gen3_thermal: add reading fuses for Gen4

The registers are differently named and at different offsets, but their
functionality is the same as for Gen3.

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com

drivers/thermal/rcar_gen3_thermal: refactor reading fuses into seprarate function

Gen4 will be very different, so refactor Gen3 access into separate call
first.

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com

drivers/thermal/rcar_gen3_thermal: introduce 'info' structure

More items to describe the TSCs are needed soon, so encapsulate the
current 'ths_tj_1' item into a struct.

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com

thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling

R-Car H3 ES1.* was only available to an internal development group and
needed a lot of quirks and workarounds. These become a maintenance
burden now, so our development group decided to remove upstream support
and disable booting for this SoC. Public users only have ES2 onwards.

Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()

The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().

Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.

Remove the call and again prevent the drivers to access the thermal
internals.

Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers

The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: Remove core header inclusion from drivers

As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.

Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.

Remove this inclusion in every place where it is possible.

Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.

The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.

The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/rcar_gen3_thermal: Fix device initialization

The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.

The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.

Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/rcar_gen3_thermal: Create device local ops struct

The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.

Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/rcar_gen3_thermal: Do not call set_trips() when resuming

There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.

Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/rcar_gen3: Add support for R-Car V4H

Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.

According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/rcar_gen3: Use the generic function to get the number of trips

The thermal core framework allows to get the number of thermal trips,
use it instead of visiting the thermal core structure internals.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20221003092602.1323944-16-daniel.lezcano@linaro.org

thermal/drivers/rcar: Switch to new of API

The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.

Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Tested-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20220804224349.1926752-18-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

drivers/thermal/rcar_gen3_thermal: Improve logging during probe

When setting up a new board, a plain "Can't register thermal zone"
didn't help me much because the thermal zones in DT were all fine. I
just had a sensor entry too much in the parent TSC node. Reword the
failure/success messages to contain the sensor number to make it easier
to understand which sensor is affected. Example output now:

rcar_gen3_thermal e6198000.thermal: Sensor 0: Loaded 1 trip points
rcar_gen3_thermal e6198000.thermal: Sensor 1: Loaded 1 trip points
rcar_gen3_thermal e6198000.thermal: Sensor 2: Loaded 1 trip points
rcar_gen3_thermal e6198000.thermal: Sensor 3: Can't register thermal zone

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20220610200500.6727-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/rcar_gen3_thermal: Add r8a779f0 support

Add support for R-Car S4.

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220705195520.2581-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: rcar_gen3_thermal: Read calibration from hardware

In production hardware the calibration values used to convert register
values to temperatures can be read from hardware. While pre-production
hardware still depends on pseudo values hard-coded in the driver.

Add support for reading out calibration values from hardware if it's
fused. The presence of fused calibration is indicated in the THSCP
register.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20211014103816.1939782-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: rcar_gen3_thermal: Store thcode and ptat in priv data

Prepare for reading the THCODE and PTAT values from hardware fuses by
storing the values used during calculations in the drivers private
data structures.

As the values are now stored directly in the private data structures
there is no need to keep track of the TSC channel id as its only usage
was to lookup the THCODE row, drop it.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20211014103816.1939782-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int

The TSC id and number of TSC ids should be stored as unsigned int as
they can't be negative. Fix the datatype of the loop counter 'i' and
rcar_gen3_thermal_tsc.id to reflect this.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210804091818.2196806-3-niklas.soderlund+renesas@ragnatech.se

thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points

All supported hardware except V3U is capable of generating interrupts
to the CPU when the temperature go below or above a set value. Use this
to implement support for the set_trip() feature of the thermal core on
supported hardware.

The V3U have its interrupts routed to the ECM module and therefore can
not be used to implement set_trip() as the driver can't be made aware of
when the interrupt triggers.

Each TSC is capable of tracking up-to three different temperatures while
only two are needed to implement the tracking of the thermal window.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210804091818.2196806-2-niklas.soderlund+renesas@ragnatech.se

thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1

With -Wshadow:

drivers/thermal/rcar_gen3_thermal.c: In function ‘rcar_gen3_thermal_probe’:
drivers/thermal/rcar_gen3_thermal.c:310:13: warning: declaration of ‘rcar_gen3_ths_tj_1’ shadows a global declaration [-Wshadow]
310 | const int *rcar_gen3_ths_tj_1 = of_device_get_match_data(dev);
| ^~~~~~~~~~~~~~~~~~
drivers/thermal/rcar_gen3_thermal.c:246:18: note: shadowed declaration is here
246 | static const int rcar_gen3_ths_tj_1 = 126;
| ^~~~~~~~~~~~~~~~~~

To add to the confusion, the local variable has a different type.

Fix the shadowing by renaming the local variable to ths_tj_1.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/9ea7e65d0331daba96f9a7925cb3d12d2170efb1.1623076804.git.geert+renesas@glider.be

thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations

The fixed value of 157 used in the calculations are only correct for
M3-W, on other Gen3 SoC it should be 167. The constant can be derived
correctly from the static TJ_3 constant and the SoC specific TJ_1 value.
Update the calculation be correct on all Gen3 SoCs.

Fixes: 4eb39f79ef44 ("thermal: rcar_gen3_thermal: Update value of Tj_1")
Reported-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210605085211.564909-1-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Add support for up to five TSC nodes

Add support for up to five TSC nodes. The new THCODE values are taken
from the example in the datasheet.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210309162419.2621359-1-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Add r8a779a0 support

Add support for R-Car V3U. The new THCODE values are taken from the
example in the datasheet.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126223028.3119044-4-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Do not use interrupts for normal operation

Remove the usage of interrupts for the normal temperature operation and
depend on the polling performed by the thermal core. This is done to
prepare to use the interrupts as they are intended to trigger once
specific trip points are passed and not to react to temperature changes
in the normal operational range.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126220923.3107213-1-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Do not shadow thcode variable

The function rcar_gen3_thermal_calc_coefs() takes an argument called
'thcode' which shadows the static global 'thcode' variable. This is not
harmful but bad for readability and is harmful for planned changes to
the driver. The THCODE values should be read from hardware fuses if they
are available and only fallback to the global 'thcode' variable if they
are not fused.

Rename the global 'thcode' variable to 'thcodes' to avoid shadowing the
symbol in functions that take it as an argument.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200610003300.884258-1-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Add r8a774e1 support

Add r8a774e1 specific compatible string.

Signed-off-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com>
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1594811350-14066-4-git-send-email-prabhakar.mahadev-lad.rj@bp.renesas.com

thermal/drivers/rcar_gen3: Fix undefined temperature if negative

As description for DIV_ROUND_CLOSEST in file include/linux/kernel.h.
"Result is undefined for negative divisors if the dividend variable
type is unsigned and for negative dividends if the divisor variable
type is unsigned."

In current code, the FIXPT_DIV uses DIV_ROUND_CLOSEST but has not
checked sign of divisor before using. It makes undefined temperature
value in case the value is negative.

This patch fixes to satisfy DIV_ROUND_CLOSEST description
and fix bug too. Note that the variable name "reg" is not good
because it should be the same type as rcar_gen3_thermal_read().
However, it's better to rename the "reg" in a further patch as
cleanup.

Signed-off-by: Van Do <van.do.xw@renesas.com>
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
[shimoda: minor fixes, add Fixes tag]
Fixes: 564e73d283af ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1593085099-2057-1-git-send-email-yoshihiro.shimoda.uh@renesas.com

thermal: rcar_gen3_thermal: Add r8a77961 support

Add support for the Thermal Sensor/Chip Internal Voltage Monitor in the
R-Car M3-W+ (R8A77961) SoC.

According to the R-Car Gen3 Hardware Manual Errata for Revision 2.00 of
Jan 31, 2020, the thermal parameters for R-Car M3-W+ are the same as for
R-Car M3-W.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200306105503.24267-3-geert+renesas@glider.be

thermal: rcar_gen3_thermal: Generate interrupt when temperature changes

The desired behavior of the driver is to generate an interrupt and call
thermal_zone_device_update() as soon as the temperature have changed
more then one degree.

When the set_trips operation was implemented it was believed that the
trip window set by the framework would move around the current
temperature and the hysteresis value described in devicetree. The
behavior of the framework is however to set a window based on the trip
points described in devicetree.

Remove the set_trips operation which was not used correctly and update
the temperatures that triggers interrupts directly from the interrupt
handler.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200212224917.737314-1-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Remove unneeded curly brackets

When devm_add_action() was turned into devm_add_action_or_reset() the
curly brackets for the error case where kept but are not needed, remove
them to match the style of the driver.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200212224732.736785-1-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Remove temperature bound

The hardware manual states that the operation of the sensor is not
guaranteed with temperatures above 125°C, not that the readings are
invalid. Remove the bound check and try to deliver temperature readings
even if we are outside the guaranteed operation range.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200117160554.3812787-3-niklas.soderlund+renesas@ragnatech.se

thermal: rcar_gen3_thermal: Add r8a774b1 support

Add r8a774b1 specific compatible string.

Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1569248746-56718-1-git-send-email-biju.das@bp.renesas.com

thermal: rcar_gen3_thermal: Replace devm_add_action() followed by failure action with devm_add_action_or_reset()

devm_add_action_or_reset() is introduced as a helper function which
internally calls devm_add_action(). If devm_add_action() fails
then it will execute the action mentioned and return the error code.
This reduce source code size (avoid writing the action twice)
and reduce the likelyhood of bugs.

Signed-off-by: Fuqian Huang <huangfq.daxian@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: rcar_gen3_thermal: Update temperature conversion method

Update the formula to calculate temperature:
Currently, current TEMP is calculated as
average of val1 (is calculated by formula 1)
and val2 (is calculated by formula 2). But,
as description in HWM (chapter 10A.3.1.2 Normal Mode.)

If (TEMP_CODE < THCODE2[11:0]) CTEMP value should be val1.
If (TEMP_CODE > THCODE2[11:0]) CTEMP value should be val2.

Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Update calculation formula of IRQTEMP

Update the formula to calculate CTEMP:
Currently, the CTEMP is average of val1 (is calculated by
formula 1) and val2 (is calculated by formula 2). But,
as description in HWM (chapter 10A.3.1.1 Setting of Normal Mode)

If (STEMP < Tj_T) CTEMP value should be val1.
If (STEMP > Tj_T) CTEMP value should be val2.

Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Update value of Tj_1

As evaluation of hardware team, temperature calculation formula
of M3-W is difference from all other SoCs as below:
- M3-W: Tj_1: 116 (so Tj_1 - Tj_3 = 157)
- Others: Tj_1: 126 (so Tj_1 - Tj_3 = 167)

Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Fix to show correct trip points number

Currently after store trip points number in 'ret', it is overwritten
afterwards, this cause incorrect trip point number always be shown in
the debug information after register of each thermal zone.

This patch fix this issue by moving get of trip number to
end of thermal zone registration.

Fixes: 6269e9f790e8d ("thermal: rcar_gen3_thermal: Register hwmon sysfs interface")
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: disable interrupt in .remove

Currently IRQ remains enabled after .remove, later if device is probed,
IRQ is requested before .thermal_init, this may cause IRQ function be
called before device is initialized.

this patch disables interrupt in .remove, to ensure irq function
only be called after device is fully initialized.

Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: fix interrupt type

Currently IRQF_SHARED type interrupt line is allocated, but it
is not appropriate, as the interrupt line isn't shared between
different devices, instead IRQF_ONESHOT is the proper type.

By changing interrupt type to IRQF_ONESHOT, now irq handler is
no longer needed, as clear of interrupt status can be done in
threaded interrupt context.

Because IRQF_ONESHOT type interrupt line is kept disabled until
the threaded handler has been run, so there is no need to protect
read/write of REG_GEN3_IRQSTR with lock.

Fixes: 7d4b269776ec6 ("enable hardware interrupts for trip points")
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Fix init value of IRQCTL register

Fix setting value for IRQCTL register. We are setting the last 6 bits
of (IRQCTL) to be 1 (0x3f), this is only suitable for H3ES1.*, according
to Hardware manual values 1 are "setting prohibited" for Gen3.

Signed-off-by: Hoan Nguyen An <na-hoan@jinso.co.jp>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Register hwmon sysfs interface

Register the hwmon sysfs interface on R-Car Gen3 thermal driver to
align it with Gen2 driver. Use devm_add_action() to unregister the
hwmon interface automatically.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Wolfram Sang <wsa+renesas@sang-engineering.com>
Cc: linux-renesas-soc@vger.kernel.org
To: linux-pm@vger.kernel.org
From: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: add R8A77980 support

Add the R-Car V3H (R8A77980) SoC support to the R-Car gen3 thermal driver.

Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Add r8a774a1 support

Add r8a774a1 specific compatible string.

Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: convert to SPDX identifiers

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: add r8a77965 support

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: update max temperature clamp

Change the upper limit to clamp the high temperature value to 120C when
setting trip points.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Update calculation formula due to HW evaluation

Due to hardware evaluation result,
Max temperature is changed from 96 to 116 degree Celsius.
Also, calculation formula and pseudo FUSE values are changed accordingly.

Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: fix initialization sequence for H3 ES2.0

The initialization sequence for H3 (r8a7795) ES1.x and ES2.0 is
different. H3 ES2.0 and later uses the same sequence as M3 (r8a7796)
ES1.0. Fix this by not looking at compatible strings and instead
defaulting to the r8a7796 initialization sequence and use
soc_device_match() to check for H3 ES1.x.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: constify thermal_zone_of_device_ops structures

The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const. Thus the thermal_zone_of_device_ops structure itself can
be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: rcar_gen3_thermal: add suspend and resume support

To restore operation it's easiest to reinitialise all TSCs. In order to
do this the current trip window needs to be stored in the TSC structure
so that it can be restored upon resume.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: store device match data in private structure

The device match data needs to be accessible outside the probe function,
store it in the private data structure.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: enable hardware interrupts for trip points

Enable hardware trip points by implementing the set_trips callback. The
thermal core will take care of setting the initial trip point window and
to update it once the driver reports a TSC has moved outside it.

The interrupt structure for this device is a bit odd. There is not a
dedicated IRQ for each TSC, instead the interrupts are shared between
all TSCs. IRQn is fired if the temp monitored in IRQTEMPn is reached in
any of the TSCs, example IRQ3 is fired if temperature in IRQTEMP3 is
reached in either TSC0, TSC1 or TSC2.

For this reason the usage of interrupts in this driver is an all-on or
all-off design. When an interrupt happens all TSCs are checked and all
thermal zones are updated. This could be refined to be more fine grained
but the thermal core takes care of only updating the thermal zones that
have left their trip point window.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: record and check number of TSCs found

Record how many TSCs are found in struct rcar_gen3_thermal_priv, this is
needed to be able to add hardware interrupts for trip points later. Also
add a check to make sure at least one TSC is found.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: check that TSC exists before memory allocation

Move the check for a TSC resource before allocating memory for a new
TSC. If no TSC is found there is little point in allocating memory for
it.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: remove unneeded mutex

There is no point in protecting a register read with a lock. This is
most likely a leftover from when the driver was reworked before being
submitted for upstream.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: add delay in .thermal_init on r8a7796

The .thermal_init needs to be delayed a short amount of time to allow
for the TEMP register to contain something useful. If it's not delayed
these warnings are common during boot:

thermal thermal_zone0: failed to read out thermal zone (-5)
thermal thermal_zone1: failed to read out thermal zone (-5)
thermal thermal_zone2: failed to read out thermal zone (-5)

The warnings are triggered by the first call to .get_temp() while the
TEMP register contains 0 and rcar_gen3_thermal_get_temp() returns -EIO
since a TEMP value of 0 will result in a temperature reading which is
out of specifications.

This should have been done in the initial commit which adds the driver
as the same issue was found and corrected for r8a7795.

Fixes: 564e73d283af9d4c ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver

Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.

Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>