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f6a756e8 |
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14-Jul-2023 |
Rob Herring <robh@kernel.org> |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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b0526e02 |
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20-Jun-2023 |
Yangtao Li <frank.li@vivo.com> |
thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe() The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
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4a16c190 |
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01-Mar-2023 |
Daniel Lezcano <daniel.lezcano@linaro.org> |
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs() The devres variant of thermal_add_hwmon_sysfs() only takes the thermal zone structure pointer as parameter. Actually, it uses the tz->device to add it in the devres list. It is preferable to use the device registering the thermal zone instead of the thermal zone device itself. That prevents the driver accessing the thermal zone structure internals and it is from my POV more correct regarding how devm_ is used. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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abda7383 |
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01-Mar-2023 |
Daniel Lezcano <daniel.lezcano@linaro.org> |
thermal: Remove debug or error messages in get_temp() ops Some get_temp() ops implementation are showing an error or a debug message if the reading of the sensor fails. The debug message is already displayed from the call site of this ops. So we can remove it. On the other side, the error should not be displayed because in production that can raise tons of messages. Finally, some drivers are showing a debug message with the temperature, this is also accessible through the trace from the core code in the temperature_update() function. Another benefit is the dev_* messages are accessing the thermal zone device field from the structure, so we encapsulate even more the code by preventing these accesses. Remove those messages. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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5f68d078 |
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01-Mar-2023 |
Daniel Lezcano <daniel.lezcano@linaro.org> |
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car Acked-by: Mark Brown <broonie@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062 Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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9272d2d4 |
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06-Feb-2023 |
Daniel Lezcano <daniel.lezcano@linaro.org> |
thermal: Remove core header inclusion from drivers As the name states "thermal_core.h" is the header file for the core components of the thermal framework. Too many drivers are including it. Hopefully the recent cleanups helped to self encapsulate the code a bit more and prevented the drivers to need this header. Remove this inclusion in every place where it is possible. Some other drivers did a confusion with the core header and the one exported in linux/thermal.h. They include the former instead of the latter. The changes also fix this. The tegra/soctherm driver still remains as it uses an internal function which need to be replaced. The Intel HFI driver uses the netlink internal framework core and should be changed to prevent to deal with the internals. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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1cea9959 |
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17-Jan-2023 |
Viorel Suman <viorel.suman@nxp.com> |
thermal/drivers/imx_sc_thermal: Add iMX8QM sensors Add iMX8QM sensors. As stated in 31fd4b9db13b ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id"): The thermal OF code returns -ENODEV if the thermal zone registration with a specific id fails because the description is not available in the DT for such a sensor id. In this case we continue with the other ids without bailing out with an error. Signed-off-by: Viorel Suman <viorel.suman@nxp.com> Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com> Link: https://lore.kernel.org/r/20230117091956.61729-2-viorel.suman@oss.nxp.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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4b26b7c9 |
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17-Jan-2023 |
Viorel Suman <viorel.suman@nxp.com> |
thermal/drivers/imx_sc_thermal: Fix the loop condition The minimal resource ID is 0: IMX_SC_R_AP_0=0, so fix the loop condition. Aside of this - constify the array. Fixes: 31fd4b9db13b ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id") Signed-off-by: Viorel Suman <viorel.suman@nxp.com> Reviewed-by: Dong Aisheng <Aisheng.dong@nxp.com> Link: https://lore.kernel.org/r/20230117091956.61729-1-viorel.suman@oss.nxp.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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5011a110 |
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12-Dec-2022 |
Uwe Kleine-König <u.kleine-koenig@pengutronix.de> |
thermal/drivers/imx_sc_thermal: Drop empty platform remove function A remove callback just returning 0 is equivalent to no remove callback at all. So drop the useless function. Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de> Link: https://lore.kernel.org/r/20221212220217.3777176-1-u.kleine-koenig@pengutronix.de Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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31fd4b9d |
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18-Aug-2022 |
Daniel Lezcano <daniel.lezcano@linaro.org> |
thermal/drivers/imx_sc: Rely on the platform data to get the resource id Currently the imx_sc driver is reimplementing part of the thermal zone parsing from the thermal OF tree code to get the sensor id associated with a thermal zone sensor. The driver platform specific code should know what sensor is present and not rely on the thermal zone description to do a discovery. Well that is arguable but all the other drivers have a per platform data telling what sensor id to use. The imx_sc thermal driver is the only one using a different approach. Not invalid but forcing to keep a specific function 'thermal_zone_of_get_sensor_id()' to get the sensor id for a specific thermal zone as the self-explanatory function tells and having device tree code inside the driver. The thermal OF code had a rework and remains now self-encapsulated with a register/unregister functions and their 'devm' variants, except for the function mentioned above. After investigating, it appears the imx_sc sensor is defined in arch/arm64/boot/dts/freescale/imx8qxp.dtsi: which defines the cpu-thermal zone with the id: IMX_SC_R_SYSTEM This dtsi is included by: - imx8qxp-ai_ml.dts - imx8qxp-colibri.dtsi - imx8qxp-mek.dts The two first ones do not define more thermal zones The third one adds the pmic-thermal0 zone with id: IMX_SC_R_PMIC_0 The thermal OF code returns -ENODEV if the thermal zone registration with a specific id fails because the description is not available in the DT for such a sensor id. In this case we continue with the other ids without bailing out with an error. So we can build for the 'fsl,imx-sc-thermal' a compatible data, an array of sensor ids containing IMX_SC_R_SYSTEM and IMX_SC_R_PMIC_0. The latter won't be found but that will not result in an error but a normal case where we continue the initialization with other ids. Just to clarify, it is what the thermal framework does and what the other drivers are expecting: when a registration fails with -ENODEV this is not an error but a case where the description is not found in the device tree, that be can the entire thermal zones description or a specific thermal zone with an unknown id. There is one small functional change but without impact. When there is no 'thermal-zones' description the probe function was returning '-ENODEV', now it returns zero. When a thermal zone fails to register with an error different from '-ENODEV', the error is detected and returned. Change the code accordingly and remove the OF code from the driver. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20220818082316.2717095-1-daniel.lezcano@linaro.org
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32fb9a8a |
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04-Aug-2022 |
Daniel Lezcano <daniel.lezcano@linexp.org> |
thermal/drivers/imx: Switch to new of API The thermal OF code has a new API allowing to migrate the OF initialization to a simpler approach. The ops are no longer device tree specific and are the generic ones provided by the core code. Convert the ops to the thermal_zone_device_ops format and use the new API to register the thermal zone with these generic ops. Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org> Link: https://lore.kernel.org/r/20220804224349.1926752-17-daniel.lezcano@linexp.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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09700c50 |
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16-May-2022 |
Miaoqian Lin <linmq006@gmail.com> |
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe of_find_node_by_name() returns a node pointer with refcount incremented, we should use of_node_put() on it when done. Add missing of_node_put() to avoid refcount leak. Fixes: e20db70dba1c ("thermal: imx_sc: add i.MX system controller thermal support") Signed-off-by: Miaoqian Lin <linmq006@gmail.com> Link: https://lore.kernel.org/r/20220517055121.18092-1-linmq006@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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3da97620 |
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14-Jun-2021 |
Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> |
thermal/drivers/imx_sc: Add missing of_node_put for loop iteration Early exits from for_each_available_child_of_node() should decrement the node reference counter. Reported by Coccinelle: drivers/thermal/imx_sc_thermal.c:93:1-33: WARNING: Function "for_each_available_child_of_node" should have of_node_put() before return around line 97. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Reviewed-by: Jacky Bai <ping.bai@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210614192230.19248-1-krzysztof.kozlowski@canonical.com
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755a7397 |
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26-Apr-2020 |
Dong Aisheng <aisheng.dong@nxp.com> |
dt-bindings: firmware: imx: Move system control into dt-binding headfile i.MX8 SoCs DTS file needs system control macro definitions, so move them into dt-binding headfile, then include/linux/firmware/imx/types.h can be removed and those drivers using it should be changed accordingly. Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com> Signed-off-by: Jacky Bai <ping.bai@nxp.com> Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Shawn Guo <shawnguo@kernel.org>
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d2bc4dd9 |
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25-Mar-2020 |
Anson Huang <Anson.Huang@nxp.com> |
thermal: imx_sc_thermal: Add hwmon support Expose i.MX SC thermal sensors as HWMON devices. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1585192411-25593-1-git-send-email-Anson.Huang@nxp.com
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968ea0df |
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19-Mar-2020 |
Anson Huang <Anson.Huang@nxp.com> |
thermal: imx_sc_thermal: Fix incorrect data type The temperature value passed from SCU could be negative value, the data type should be signed instead of unsigned. Fixes: e20db70dba1c ("thermal: imx_sc: add i.MX system controller thermal support") Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1584606380-9972-1-git-send-email-Anson.Huang@nxp.com
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1fd213f3 |
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01-Mar-2020 |
Anson Huang <Anson.Huang@nxp.com> |
thermal: imx_sc_thermal: Align imx sc thermal msg structs to 4 The i.MX SCU API strongly assumes that messages are composed out of 4-bytes words but some of our message structs have odd sizeofs, use __packed __aligned(4) to avoid potential oopses. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1583117485-30922-1-git-send-email-Anson.Huang@nxp.com
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e20db70d |
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21-Feb-2020 |
Anson Huang <Anson.Huang@nxp.com> |
thermal: imx_sc: add i.MX system controller thermal support i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
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