thermal: Drop spaces before TABs

There is never a need to have a space before a TAB, but it hurts the
eyes of vim users.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/480478a53fd42621e97b2db36e181903cc0f53e3.1708001426.git.geert+renesas@glider.be

thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.

The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.

The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:

thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table

The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:

Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).

It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/drivers/loongson-2: Add thermal management support

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.

Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn>
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn

thermal/core: Relocate the traces definition in thermal directory

The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.

Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org

thermal/drivers/mediatek: Relocate driver to mediatek folder

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/core: Move the thermal trip code to a dedicated file

The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...

This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.

For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.

The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS

The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. This unnecessarily reduces
build coverage.

Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: k3_j72xx_bandgap: Add the bandgap driver support

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.

J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455

The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these register values when translating the Temperature
Monitor output codes to temperature values.

It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.

-40C to 30C
30C to 125C
125C to 150C

With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.

Tested temperature reading on J721e SoC & J7200 SoC.

[daniel.lezcano@linaro.org: Generate look-up tables run-time]

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/zx: Remove zx driver

The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org

thermal/drivers/tango: Remove tango driver

The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org

thermal/drivers/clock_cooling: Remove clock_cooling code

clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/aa5d5ac2589cf7b14ece882130731b4a916849a6.1593619943.git.amit.kucheria@linaro.org

thermal: netlink: Fix compilation error when CONFIG_NET=n

When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.

As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.

Reported-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org

thermal: core: genetlink support for events/cmd/sampling

Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.

The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.

At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.

The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.

The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.

This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.

In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.

Also, a list of commands to discover the thermal setup is added and
can be extended when needed.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org

thermal: Add support for the MCU controlled FAN on Khadas boards

The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.

Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>

thermal/of: Rename of-thermal.c

Core thermal framework code files should start with thermal_*.
of-thermal.c does not follow this pattern and can easily be confused
with platform driver.

Fix this by renaming it to thermal_of.c

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f5e233d5c5dcc7c7cb56b3448da255cb2c9ef0d1.1589199124.git.amit.kucheria@linaro.org

thermal/governors: Prefix all source files with gov_

Bang-bang governor source file is prefixed with gov_. Do the same for
other governors for consistency so they're easy to find in the sources.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b9a85d3204712f14e320504948c12712dc0b291b.1589199124.git.amit.kucheria@linaro.org

thermal: k3: Add support for bandgap sensors

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com

thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit

i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com

thermal: imx_sc: add i.MX system controller thermal support

i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..

This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com

thermal: sprd: Add Spreadtrum thermal driver support

This patch adds the support for Spreadtrum thermal sensor controller,
which can support maximum 8 sensors.

Signed-off-by: Freeman Liu <freeman.liu@unisoc.com>
Co-developed-with: Baolin Wang <baolin.wang@unisoc.com>
Signed-off-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com

thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40

This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com

thermal/drivers/cpu_cooling: Rename to cpufreq_cooling

As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org

thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver

The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org

thermal/drivers/Kconfig: Convert the CPU cooling device to a choice

The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.

There is no functional changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org

thermal: amlogic: Add thermal driver to support G12 SoCs

Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).

The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.

Implement reading the temperature from each thermal sensor.

The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold

Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com

thermal: Introduce Amazon's Annapurna Labs Thermal Driver

This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.

This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.

Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir

This cleans up the directory a bit allowing just one place to look for
thermal related drivers for QCOM platforms instead of being scattered in
the root directory and the qcom/ subdirectory. Compile-tested with
ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

drivers: thermal: Move various drivers for intel platforms into a subdir

This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add stm32 thermal driver

Add support for DTS thermal sensor that can be
found on some STM32 platforms.

This driver is based on OF and works in interrupt
mode.

It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.

Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

License cleanup: add SPDX GPL-2.0 license identifier to files with no license

Many source files in the tree are missing licensing information, which
makes it harder for compliance tools to determine the correct license.

By default all files without license information are under the default
license of the kernel, which is GPL version 2.

Update the files which contain no license information with the 'GPL-2.0'
SPDX license identifier. The SPDX identifier is a legally binding
shorthand, which can be used instead of the full boiler plate text.

This patch is based on work done by Thomas Gleixner and Kate Stewart and
Philippe Ombredanne.

How this work was done:

Patches were generated and checked against linux-4.14-rc6 for a subset of
the use cases:
- file had no licensing information it it.
- file was a */uapi/* one with no licensing information in it,
- file was a */uapi/* one with existing licensing information,

Further patches will be generated in subsequent months to fix up cases
where non-standard license headers were used, and references to license
had to be inferred by heuristics based on keywords.

The analysis to determine which SPDX License Identifier to be applied to
a file was done in a spreadsheet of side by side results from of the
output of two independent scanners (ScanCode & Windriver) producing SPDX
tag:value files created by Philippe Ombredanne. Philippe prepared the
base worksheet, and did an initial spot review of a few 1000 files.

The 4.13 kernel was the starting point of the analysis with 60,537 files
assessed. Kate Stewart did a file by file comparison of the scanner
results in the spreadsheet to determine which SPDX license identifier(s)
to be applied to the file. She confirmed any determination that was not
immediately clear with lawyers working with the Linux Foundation.

Criteria used to select files for SPDX license identifier tagging was:
- Files considered eligible had to be source code files.
- Make and config files were included as candidates if they contained >5
lines of source
- File already had some variant of a license header in it (even if <5
lines).

All documentation files were explicitly excluded.

The following heuristics were used to determine which SPDX license
identifiers to apply.

- when both scanners couldn't find any license traces, file was
considered to have no license information in it, and the top level
COPYING file license applied.

For non */uapi/* files that summary was:

SPDX license identifier # files
---------------------------------------------------|-------
GPL-2.0 11139

and resulted in the first patch in this series.

If that file was a */uapi/* path one, it was "GPL-2.0 WITH
Linux-syscall-note" otherwise it was "GPL-2.0". Results of that was:

SPDX license identifier # files
---------------------------------------------------|-------
GPL-2.0 WITH Linux-syscall-note 930

and resulted in the second patch in this series.

- if a file had some form of licensing information in it, and was one
of the */uapi/* ones, it was denoted with the Linux-syscall-note if
any GPL family license was found in the file or had no licensing in
it (per prior point). Results summary:

SPDX license identifier # files
---------------------------------------------------|------
GPL-2.0 WITH Linux-syscall-note 270
GPL-2.0+ WITH Linux-syscall-note 169
((GPL-2.0 WITH Linux-syscall-note) OR BSD-2-Clause) 21
((GPL-2.0 WITH Linux-syscall-note) OR BSD-3-Clause) 17
LGPL-2.1+ WITH Linux-syscall-note 15
GPL-1.0+ WITH Linux-syscall-note 14
((GPL-2.0+ WITH Linux-syscall-note) OR BSD-3-Clause) 5
LGPL-2.0+ WITH Linux-syscall-note 4
LGPL-2.1 WITH Linux-syscall-note 3
((GPL-2.0 WITH Linux-syscall-note) OR MIT) 3
((GPL-2.0 WITH Linux-syscall-note) AND MIT) 1

and that resulted in the third patch in this series.

- when the two scanners agreed on the detected license(s), that became
the concluded license(s).

- when there was disagreement between the two scanners (one detected a
license but the other didn't, or they both detected different
licenses) a manual inspection of the file occurred.

- In most cases a manual inspection of the information in the file
resulted in a clear resolution of the license that should apply (and
which scanner probably needed to revisit its heuristics).

- When it was not immediately clear, the license identifier was
confirmed with lawyers working with the Linux Foundation.

- If there was any question as to the appropriate license identifier,
the file was flagged for further research and to be revisited later
in time.

In total, over 70 hours of logged manual review was done on the
spreadsheet to determine the SPDX license identifiers to apply to the
source files by Kate, Philippe, Thomas and, in some cases, confirmation
by lawyers working with the Linux Foundation.

Kate also obtained a third independent scan of the 4.13 code base from
FOSSology, and compared selected files where the other two scanners
disagreed against that SPDX file, to see if there was new insights. The
Windriver scanner is based on an older version of FOSSology in part, so
they are related.

Thomas did random spot checks in about 500 files from the spreadsheets
for the uapi headers and agreed with SPDX license identifier in the
files he inspected. For the non-uapi files Thomas did random spot checks
in about 15000 files.

In initial set of patches against 4.14-rc6, 3 files were found to have
copy/paste license identifier errors, and have been fixed to reflect the
correct identifier.

Additionally Philippe spent 10 hours this week doing a detailed manual
inspection and review of the 12,461 patched files from the initial patch
version early this week with:
- a full scancode scan run, collecting the matched texts, detected
license ids and scores
- reviewing anything where there was a license detected (about 500+
files) to ensure that the applied SPDX license was correct
- reviewing anything where there was no detection but the patch license
was not GPL-2.0 WITH Linux-syscall-note to ensure that the applied
SPDX license was correct

This produced a worksheet with 20 files needing minor correction. This
worksheet was then exported into 3 different .csv files for the
different types of files to be modified.

These .csv files were then reviewed by Greg. Thomas wrote a script to
parse the csv files and add the proper SPDX tag to the file, in the
format that the file expected. This script was further refined by Greg
based on the output to detect more types of files automatically and to
distinguish between header and source .c files (which need different
comment types.) Finally Greg ran the script using the .csv files to
generate the patches.

Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Philippe Ombredanne <pombredanne@nexb.com>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

thermal: Add Tegra BPMP thermal sensor driver

On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>

thermal: uniphier: add UniPhier thermal driver

Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: bcm2835: move to the broadcom subdirectory

We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.

Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: da9062/61: Thermal junction temperature monitoring driver

Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.

If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.

The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).

This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.

When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.

This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: broadcom: add Northstar thermal driver

Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: bcm2835: add thermal driver for bcm2835 SoC

Add basic thermal driver for bcm2835 SoC.

This driver currently make sure that tsense HW block is set up
correctly.

Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

cpufreq: dbx500: Manage cooling device from cpufreq driver

The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.

The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.

Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: zx2967: add thermal driver for ZTE's zx2967 family

This patch adds thermal driver for ZTE's zx2967 family.

Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver

Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.

Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: core: introduce thermal_helpers.c

Here we have a simple code organization. This patch moves
functions that do not need to handle thermal core internal
data structure to thermal_helpers.c file.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: core: move thermal_zone sysfs to thermal_sysfs.c

This is a code reorganization, simply to concentrate
the code handling sysfs in a specific file: thermal_sysfs.c.

Right now, moving only the sysfs entries of thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: max77620: Add thermal driver for reporting junction temp

Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: qoriq: Add thermal management support

This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.

Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: qcom: tsens: Add a skeletal TSENS drivers

TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add Intel BXT WhiskeyCove PMIC thermal driver

This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.

Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: generic-adc: Add ADC based thermal sensor driver

In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.

Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: add temperature sensor support for tango SoC

The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.

Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: tegra: move tegra thermal files into tegra directory

Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add Mediatek thermal controller support

This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add devfreq cooling

Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq. In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add Intel PCH thermal driver

This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.

Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: hisilicon: add new hisilicon thermal sensor driver

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: introduce the Power Allocator governor

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add QPNP PMIC temperature alarm driver

Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: intel Quark SoC X1000 DTS thermal driver

In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
- to read DTS temperature
$ cat temp
- to read critical trip point
$ cat trip_point_0_temp
- to read trip point type
$ cat trip_point_0_type
- to emulate temperature raise to test orderly shutdown by Linux distro
$ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Intel SoC: DTS thermal IOSF core

This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

thermal: rockchip: add driver for thermal

Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Add Tegra SOCTHERM thermal management driver

This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: introduce clock cooling device

This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal: introduce int3403 thermal driver

ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.

Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: introduce int3400 thermal driver

Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Added Bang-bang thermal governor

The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device. It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only. For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: sti: Introduce ST Thermal core code

This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.

Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Intel SoC DTS thermal

In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: ACPI INT3403 thermal driver

The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: introduce device tree parser

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: hwmon: move hwmon support to single file

In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: exynos: Moving exynos thermal files into samsung directory

This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: add imx thermal driver support

This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid). Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs. The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Thermal: CPU Package temperature thermal

This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: introduce TI SoC thermal driver

This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: build cpu_cooling code into thermal_sys module

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>

Thermal: build thermal governors into thermal_sys module

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>

Thermal: rename thermal_sys.c to thermal_core.c

this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>

thermal: Add driver for Armada 370/XP SoC thermal management

This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: rename thermal governor Kconfig option to avoid generic naming

Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Dove: Add Themal sensor support for Dove.

The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add support for the thermal sensor on Kirkwood SoCs

This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

PM: Introduce Intel PowerClamp Driver

Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add ST-Ericsson DB8500 thermal driver.

This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically. The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

drivers/thermal/Makefile refactor

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add a thermal notifier for user space

This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Introduce a step_wise thermal governor

This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Introduce fair_share thermal governor

This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

hwmon: exynos4: move thermal sensor driver to driver/thermal directory

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add generic cpufreq cooling implementation

This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:

* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,

a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
| |
\|/ |
Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add Renesas R-Car thermal sensor support

This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add support for thermal sensor present on SPEAr13xx machines

ST's SPEAr13xx machines are based on CortexA9 ARM processors. These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: re-name thermal.c to thermal_sys.c

thermal_sys was already the name of the resulting module,
and it is built from this one source file.

Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add the support for building the generic thermal as a module

Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>

the generic thermal sysfs driver

The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>