thermal: core: Eliminate writable trip points masks

All of the thermal_zone_device_register_with_trips() callers pass zero
writable trip points masks to it, so drop the mask argument from that
function and update all of its callers accordingly.

This also removes the artificial trip points per zone limit of 32,
related to using writable trip points masks.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Drop the .set_trip_hyst() thermal zone operation

None of the users of the thermal core provides a .set_trip_hyst()
thermal zone operation, so drop that callback from struct
thermal_zone_device_ops and update trip_point_hyst_store()
accordingly.

No functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Add flags to struct thermal_trip

In order to allow thermal zone creators to specify the writability of
trip point temperature and hysteresis on a per-trip basis, add a flags
field to struct thermal_trip and define flags to represent the desired
trip properties.

Also make thermal_zone_device_register_with_trips() set the
THERMAL_TRIP_FLAG_RW_TEMP flag for all trips covered by the writable
trips mask passed to it and modify the thermal sysfs code to look at
the trip flags instead of using the writable trips mask directly or
checking the presence of the .set_trip_hyst() zone callback.

Additionally, make trip_point_temp_store() and trip_point_hyst_store()
fail with an error code if the trip passed to one of them has
THERMAL_TRIP_FLAG_RW_TEMP or THERMAL_TRIP_FLAG_RW_HYST,
respectively, clear in its flags.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Store zone ops in struct thermal_zone_device

The current code requires thermal zone creators to pass pointers to
writable ops structures to thermal_zone_device_register_with_trips()
which needs to modify the target struct thermal_zone_device_ops object
if the "critical" operation in it is NULL.

Moreover, the callers of thermal_zone_device_register_with_trips() are
required to hold on to the struct thermal_zone_device_ops object passed
to it until the given thermal zone is unregistered.

Both of these requirements are quite inconvenient, so modify struct
thermal_zone_device to contain struct thermal_zone_device_ops as field and
make thermal_zone_device_register_with_trips() copy the contents of the
struct thermal_zone_device_ops passed to it via a pointer (which can be
const now) to that field.

Also adjust the code using thermal zone ops accordingly and modify
thermal_of_zone_register() to use a local ops variable during
thermal zone registration so ops do not need to be freed in
thermal_of_zone_unregister() any more.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Stanislaw Gruszka <stanislaw.gruszka@linux.intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Store zone trips table in struct thermal_zone_device

The current code expects thermal zone creators to pass a pointer to a
writable trips table to thermal_zone_device_register_with_trips() and
that trips table is then used by the thermal core going forward.

Consequently, the callers of thermal_zone_device_register_with_trips()
are required to hold on to the trips table passed to it until the given
thermal zone is unregistered, at which point the trips table can be
freed, but at the same time they are not expected to access that table
directly. This is both error prone and confusing.

To address it, turn the trips table pointer in struct thermal_zone_device
into a flex array (counted by its num_trips field), allocate it during
thermal zone device allocation and copy the contents of the trips table
supplied by the zone creator (which can be const now) into it, which
will allow the callers of thermal_zone_device_register_with_trips() to
drop their trip tables right after the zone registration.

This requires the imx thermal driver to be adjusted to store the new
temperature in its internal trips table in imx_set_trip_temp(), because
it will be separate from the core's trips table now and it has to be
explicitly kept in sync with the latter.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Stanislaw Gruszka <stanislaw.gruszka@linux.intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Change governor name to const char pointer

All users are already assigning a const char * to the `governor_name`
member of struct thermal_zone_params and to the `name` member of
struct thermal_governor.
Even if users are technically wrong, it just makes more sense to change
this member to be a const char pointer instead of doing the other way
around.

Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Use kstrdup_const() during cooling device registration

Some *thermal_cooling_device_register() calls pass a string literal as
the 'type' parameter, so kstrdup_const() can be used instead of
kstrdup() to avoid a memory allocation in such cases.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.

The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.

The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:

thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table

The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:

Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/sysfs: Update governors when the 'weight' has changed

Support governors update when the thermal instance's weight has changed.
This allows to adjust internal state for the governor.

Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
[ rjw: Add two empty code lines aroung the locking ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Add governor callback for thermal zone change

Add a new callback to the struct thermal_governor. It can be used for
updating governors when there is a change in the thermal zone internals,
e.g. thermal cooling device is bind to the thermal zone.

That makes possible to move some heavy operations like memory allocations
related to the number of cooling instances out of the throttle() callback.

Both callback code paths (throttle() and update_tz()) are protected with
the same thermal zone lock, which guaranties the consistency.

Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Fix thermal zone suspend-resume synchronization

There are 3 synchronization issues with thermal zone suspend-resume
during system-wide transitions:

1. The resume code runs in a PM notifier which is invoked after user
space has been thawed, so it can run concurrently with user space
which can trigger a thermal zone device removal. If that happens,
the thermal zone resume code may use a stale pointer to the next
list element and crash, because it does not hold thermal_list_lock
while walking thermal_tz_list.

2. The thermal zone resume code calls thermal_zone_device_init()
outside the zone lock, so user space or an update triggered by
the platform firmware may see an inconsistent state of a
thermal zone leading to unexpected behavior.

3. Clearing the in_suspend global variable in thermal_pm_notify()
allows __thermal_zone_device_update() to continue for all thermal
zones and it may as well run before the thermal_tz_list walk (or
at any point during the list walk for that matter) and attempt to
operate on a thermal zone that has not been resumed yet. It may
also race destructively with thermal_zone_device_init().

To address these issues, add thermal_list_lock locking to
thermal_pm_notify(), especially arount the thermal_tz_list,
make it call thermal_zone_device_init() back-to-back with
__thermal_zone_device_update() under the zone lock and replace
in_suspend with per-zone bool "suspend" indicators set and unset
under the given zone's lock.

Link: https://lore.kernel.org/linux-pm/20231218162348.69101-1-bo.ye@mediatek.com/
Reported-by: Bo Ye <bo.ye@mediatek.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: trip: Send trip change notifications on all trip updates

The _store callbacks of the trip point temperature and hysteresis sysfs
attributes invoke thermal_notify_tz_trip_change() to send a notification
regarding the trip point change, but when trip points are updated by the
platform firmware, trip point change notifications are not sent.

To make the behavior after a trip point change more consistent,
modify all of the 3 places where trip point temperature is updated
to use a new function called thermal_zone_set_trip_temp() for this
purpose and make that function call thermal_notify_tz_trip_change().

Note that trip point hysteresis can only be updated via sysfs and
trip_point_hyst_store() calls thermal_notify_tz_trip_change() already,
so this code path need not be changed.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Make thermal_zone_device_unregister() return after freeing the zone

Make thermal_zone_device_unregister() wait until all of the references
to the given thermal zone object have been dropped and free it before
returning.

This guarantees that when thermal_zone_device_unregister() returns,
there is no leftover activity regarding the thermal zone in question
which is required by some of its callers (for instance, modular driver
code that wants to know when it is safe to let the module go away).

Subsequently, this will allow some confusing device_is_registered()
checks to be dropped from the thermal sysfs and core code.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-and-tested-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: sysfs: Rework the handling of trip point updates

Both trip_point_temp_store() and trip_point_hyst_store() use
thermal_zone_set_trip() to update a given trip point, but none of them
actually needs to change more than one field in struct thermal_trip
representing it. However, each of them effectively calls
__thermal_zone_get_trip() twice in a row for the same trip index value,
once directly and once via thermal_zone_set_trip(), which is not
particularly efficient, and the way in which thermal_zone_set_trip()
carries out the update is not particularly straightforward.

Moreover, input processing need not be done under the thermal zone lock
in any of these functions.

Rework trip_point_temp_store() and trip_point_hyst_store() to address
the above, move the part of thermal_zone_set_trip() that is still
useful to a new function called thermal_zone_trip_updated() and drop
the rest of it.

While at it, make trip_point_hyst_store() reject negative hysteresis
values.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).

It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Add trip thresholds for trip crossing detection

The trip crossing detection in handle_thermal_trip() does not work
correctly in the cases when a trip point is crossed on the way up and
then the zone temperature stays above its low temperature (that is, its
temperature decreased by its hysteresis). The trip temperature may
be passed by the zone temperature subsequently in that case, even
multiple times, but that does not count as the trip crossing as long as
the zone temperature does not fall below the trip's low temperature or,
in other words, until the trip is crossed on the way down.

|-----------low--------high------------|
|<--------->|
| hyst |
| |
| -|--> crossed on the way up
|
<---|-- crossed on the way down

However, handle_thermal_trip() will invoke thermal_notify_tz_trip_up()
every time the trip temperature is passed by the zone temperature on
the way up regardless of whether or not the trip has been crossed on
the way down yet. Moreover, it will not call thermal_notify_tz_trip_down()
if the last zone temperature was between the trip's temperature and its
low temperature, so some "trip crossed on the way down" events may not
be reported.

To address this issue, introduce trip thresholds equal to either the
temperature of the given trip, or its low temperature, such that if
the trip's threshold is passed by the zone temperature on the way up,
its value will be set to the trip's low temperature and
thermal_notify_tz_trip_up() will be called, and if the trip's threshold
is passed by the zone temperature on the way down, its value will be set
to the trip's temperature (high) and thermal_notify_tz_trip_down() will
be called. Accordingly, if the threshold is passed on the way up, it
cannot be passed on the way up again until its passed on the way down
and if it is passed on the way down, it cannot be passed on the way down
again until it is passed on the way up which guarantees correct
triggering of trip crossing notifications.

If the last temperature of the zone is invalid, the trip's threshold
will be set depending of the zone's current temperature: If that
temperature is above the trip's temperature, its threshold will be
set to its low temperature or otherwise its threshold will be set to
its (high) temperature. Because the zone temperature is initially
set to invalid and tz->last_temperature is only updated by
update_temperature(), this is sufficient to set the correct initial
threshold values for all trips.

Link: https://lore.kernel.org/all/20220718145038.1114379-4-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Pass trip pointer to governor throttle callback

Modify the governor .throttle() callback definition so that it takes a
trip pointer instead of a trip index as its second argument, adjust the
governors accordingly and update the core code invoking .throttle().

This causes the governors to become independent of the representation
of the list of trips in the thermal zone structure.

This change is not expected to alter the general functionality.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Drop thermal_zone_device_exec()

Because thermal_zone_device_exec() has no users any more and there are
no plans to use it anywhere, revert commit 9a99a996d1ec ("thermal: core:
Introduce thermal_zone_device_exec()") that introduced it.

No functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Add function to walk trips under zone lock

Add a wrapper around for_each_thermal_trip(), called
thermal_zone_for_each_trip(), that will invoke the former under the
thermal zone lock and pass its return value to the caller.

Two drivers will be modified subsequently to use this new function.

No functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Allow trip pointers to be used for cooling device binding

Add new helper functions, thermal_bind_cdev_to_trip() and
thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
binding a cooling device to a trip point and unbinding it, respectively,
and redefine the existing helpers, thermal_zone_bind_cooling_device()
and thermal_zone_unbind_cooling_device(), as wrappers around the new
ones, respectively.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Drop trips_disabled bitmask

After recent changes, thermal_zone_get_trip() cannot fail, as invoked
from thermal_zone_device_register_with_trips(), so the only role of
the trips_disabled bitmask is struct thermal_zone_device is to make
handle_thermal_trip() skip trip points whose temperature was initially
zero. However, since the unit of temperature in the thermal core is
millicelsius, zero may very well be a valid temperature value at least
in some usage scenarios and the trip temperature may as well change
later. Thus there is no reason to permanently disable trip points
with initial temperature equal to zero.

Accordingly, drop the trips_disabled bitmask along with the code
related to it.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Ido Schimmel <idosch@nvidia.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: Constify the trip argument of the .get_trend() zone callback

Add 'const' to the definition of the 'trip' argument of the
.get_trend() thermal zone callback to indicate that the trip point
passed to it should not be modified by it and adjust the
callback functions implementing it, thermal_get_trend() in the
ACPI thermal driver and __ti_thermal_get_trend(), accordingly.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Michal Wilczynski <michal.wilczynski@intel.com>

thermal: core: Drop thermal_zone_device_register()

There are no more users of thermal_zone_device_register(), so drop it
from the core.

Note that thermal_zone_device_register_with_trips() may be renamed to
thermal_zone_device_register() in the future, but only after a grace
period allowing all of the possible work in progress that may be using
the latter to adjust.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Add function for registering tripless thermal zones

Multiple callers of thermal_zone_device_register() don't pass any trips
to it and they might use a shortened argument list for that, so add
a special function with fewer arguments for this purpose.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Clean up headers of thermal zone registration functions

For consistency, add a missing thermal_zone_device_register_with_trips()
stub for the CONFIG_THERMAL unset case, specify argument names in all of
the thermal zone registration and unregistration function headers and
make all of them use white space consistently.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Rework .get_trend() thermal zone callback

Passing a struct thermal_trip pointer instead of a trip index to the
.get_trend() thermal zone callback allows one of its 2 implementations,
the thermal_get_trend() function in the ACPI thermal driver, to be
simplified quite a bit, and the other implementation of it in the
ti-soc-thermal driver does not even use the relevant callback argument.

For this reason, change the .get_trend() thermal zone callback
definition and adjust the related code accordingly.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Drop unused .get_trip_*() callbacks

After recent changes in the ACPI thermal driver and in the Intel DTS
IOSF thermal driver, all thermal zone drivers are expected to use trip
tables for initialization and none of them should implement
.get_trip_type(), .get_trip_temp() or .get_trip_hyst() callbacks, so
drop these callbacks entirely from the core.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Rework and rename __for_each_thermal_trip()

Rework the currently unused __for_each_thermal_trip() to pass original
pointers to struct thermal_trip objects to the callback, so it can be
used for updating trip data (e.g. temperatures), rename it to
for_each_thermal_trip() and make it available to modular drivers.

Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Add priv pointer to struct thermal_trip

Add a new field called priv to struct thermal_trip to allow thermal
drivers to store pointers to their local data associated with trip
points.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: core: Introduce thermal_zone_device_exec()

Introduce a new helper function, thermal_zone_device_exec(), that can
be used by drivers to run a given callback routine under the zone lock.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: constify params in thermal_zone_device_register

Since commit 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal zone
parameters structure"), thermal_zone_device_register() allocates a copy
of the tzp argument and callers need not explicitly manage its lifetime.

This means the function no longer cares about the parameter being
mutable, so constify it.

No functional change.

Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Encapsulate tz->device field

There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.

Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.

By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/of: Unexport unused OF functions

The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.

Make them static in the C file and remove their declaration from thermal.h

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org

thermal/core: Remove thermal_bind_params structure

Remove struct thermal_bind_params because no one is using it for thermal
binding now.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330104526.3196-1-rui.zhang@intel.com

thermal: Add a thermal zone id accessor

In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.

Use the accessor in the hwmon_scmi and acpi_thermal.

No functional change intented.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/core: Add thermal_zone_device structure 'type' accessor

The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/core: Add a thermal zone 'devdata' accessor

The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal: core: Introduce thermal_cooling_device_update()

Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.

That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).

The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.

Note that the actual user of the new function will be added separately.

Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>

thermal: ACPI: Make helpers retrieve temperature only

It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.

Modify the ACPI thermal helpers accordingly and update their users.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

thermal/drivers/qcom: Fix set_trip_temp() deadlock

The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.

Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>

thermal/core: Add a generic thermal_zone_set_trip() function

The thermal zone ops defines a set_trip callback where we can invoke
the backend driver to set an interrupt for the next trip point
temperature being crossed the way up or down, or setting the low level
with the hysteresis.

The ops is only called from the thermal sysfs code where the userspace
has the ability to modify a trip point characteristic.

With the effort of encapsulating the thermal framework core code,
let's create a thermal_zone_set_trip() which is the writable side of
the thermal_zone_get_trip() and put there all the ops encapsulation.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-4-daniel.lezcano@linaro.org

thermal/core: Add a generic thermal_zone_get_trip() function

The thermal_zone_device_ops structure defines a set of ops family,
get_trip_temp(), get_trip_hyst(), get_trip_type(). Each of them is
returning a property of a trip point.

The result is the code is calling the ops everywhere to get a trip
point which is supposed to be defined in the backend driver. It is a
non-sense as a thermal trip can be generic and used by the backend
driver to declare its trip points.

Part of the thermal framework has been changed and all the OF thermal
drivers are using the same definition for the trip point and use a
thermal zone registration variant to pass those trip points which are
part of the thermal zone device structure.

Consequently, we can use a generic function to get the trip points
when they are stored in the thermal zone device structure.

This approach can be generalized to all the drivers and we can get rid
of the ops->get_trip_*. That will result to a much more simpler code
and make possible to rework how the thermal trip are handled in the
thermal core framework as discussed previously.

This change adds a function thermal_zone_get_trip() where we get the
thermal trip point structure which contains all the properties (type,
temp, hyst) instead of doing multiple calls to ops->get_trip_*.

That opens the door for trip point extension with more attributes. For
instance, replacing the trip points disabled bitmask with a 'disabled'
field in the structure.

Here we replace all the calls to ops->get_trip_* in the thermal core
code with a call to the thermal_zone_get_trip() function.

The thermal zone ops defines a callback to retrieve the critical
temperature. As the trip handling is being reworked, all the trip
points will be the same whatever the driver and consequently finding
the critical trip temperature will be just a loop to search for a
critical trip point type.

Provide such a generic function, so we encapsulate the ops
get_crit_temp() which can be removed when all the backend drivers are
using the generic trip points handling.

While at it, add the thermal_zone_get_num_trips() to encapsulate the
code more and reduce the grip with the thermal framework internals.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-2-daniel.lezcano@linaro.org

thermal: Validate new state in cur_state_store()

In cur_state_store(), the new state of the cooling device is received
from user-space and is not validated by the thermal core but the same is
left for the individual drivers to take care of. Apart from duplicating
the code it leaves possibility for introducing bugs where a driver may
not do it right.

Lets make the thermal core check the new state itself and store the max
value in the cooling device structure.

Link: https://lore.kernel.org/all/Y0ltRJRjO7AkawvE@kili/
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/of: Remove the thermal_zone_of_get_sensor_id() function

The function thermal_zone_of_get_sensor_id() is no longer used
anywhere, remove it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220818082316.2717095-2-daniel.lezcano@linaro.org

thermal: core: Increase maximum number of trip points

On one of the Chrome system, if we define more than 12 trip points,
probe for thermal sensor fails with
"int3403 thermal: probe of INTC1046:03 failed with error -22"
and throws an error as
"thermal_sys: Error: Incorrect number of thermal trips".

The thermal_zone_device_register() interface needs maximum
number of trip points supported in a zone as an argument.
This number can't exceed THERMAL_MAX_TRIPS, which is currently
set to 12. To address this issue, THERMAL_MAX_TRIPS value
has to be increased.

This interface also has an argument to specify a mask of trips
which are writable. This mask is defined as an int.
This mask sets the ceiling for increasing maximum number of
supported trips. With the current implementation, maximum number
of trips can be supported is 31.

Also, THERMAL_MAX_TRIPS macro is used in one place only.
So, remove THERMAL_MAX_TRIPS macro and compare num_trips
directly with using a macro BITS_PER_TYPE(int)-1.

Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

thermal/of: Remove old OF code

All the drivers are converted to the new OF API, remove the old OF code.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-34-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/of: Rework the thermal device tree initialization

The following changes are reworking entirely the thermal device tree
initialization. The old version is kept until the different drivers
using it are converted to the new API.

The old approach creates the different actors independently. This
approach is the source of the code duplication in the thermal OF
because a thermal zone is created but a sensor is registered
after. The thermal zones are created unconditionnaly with a fake
sensor at init time, thus forcing to provide fake ops and store all
the thermal zone related information in duplicated structures. Then
the sensor is initialized and the code looks up the thermal zone name
using the device tree. Then the sensor is associated to the thermal
zone, and the sensor specific ops are called with a second level of
indirection from the thermal zone ops.

When a sensor is removed (with a module unload), the thermal zone
stays there with the fake sensor.

The cooling device associated with a thermal zone and a trip point is
stored in a list, again duplicating information, using the node name
of the device tree to match afterwards the cooling devices.

The new approach is simpler, it creates a thermal zone when the sensor
is registered and destroys it when the sensor is removed. All the
matching between the cooling device, trip points and thermal zones are
done using the device tree, as well as bindings. The ops are no longer
specific but uses the generic ones provided by the thermal framework.

When the old code won't have any users, it can be removed and the
remaining thermal OF code will be much simpler.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-2-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/core: Add thermal_trip in thermal_zone

The thermal trip points are properties of a thermal zone and the
different sub systems should be able to save them in the thermal zone
structure instead of having their own definition.

Give the opportunity to the drivers to create a thermal zone with
thermal trips which will be accessible directly from the thermal core
framework.

As we added the thermal trip points structure in the thermal zone,
let's extend the thermal zone register function to have the thermal
trip structures as a parameter and store it in the 'trips' field of
the thermal zone structure.

The thermal zone contains the trip point, we can store them directly
when registering the thermal zone. That will allow another step
forward to remove the duplicate thermal zone structure we find in the
thermal_of code.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-9-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/core: Rename 'trips' to 'num_trips'

In order to use thermal trips defined in the thermal structure, rename
the 'trips' field to 'num_trips' to have the 'trips' field containing the
thermal trip points.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/of: Move thermal_trip structure to thermal.h

The structure thermal_trip is now generic and will be usable by the
different sensor drivers in place of their own structure.

Move its definition to thermal.h to make it accessible.

Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20220722200007.1839356-5-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/core: Remove DROP_FULL and RAISE_FULL

The trends DROP_FULL and RAISE_FULL are not used and were never used
in the past AFAICT. Remove these conditions as they seems to not be
handled anywhere.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220629151012.3115773-2-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal/drivers/thermal_of: Add change_mode ops support for thermal_of sensor

The sensor driver which register through thermal_of interface doesn't
have an option to get thermal zone mode change notification from
thermal core.

Add support for change_mode ops in thermal_of interface so that sensor
driver can use this ops for mode change notification.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Link: https://lore.kernel.org/r/1646767586-31908-1-git-send-email-quic_manafm@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

thermal: Spelling s/scallbacks/callbacks/

Fix a misspelling of the word "callbacks".

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ae38372996a23bb67769e2d62ca170ae9457c4df.1626261946.git.geert+renesas@glider.be

thermal/core: Fix thermal_cooling_device_register() prototype

There are two pairs of declarations for thermal_cooling_device_register()
and thermal_of_cooling_device_register(), and only one set was changed
in a recent patch, so the other one now causes a compile-time warning:

drivers/net/wireless/mediatek/mt76/mt7915/init.c: In function 'mt7915_thermal_init':
drivers/net/wireless/mediatek/mt76/mt7915/init.c:134:48: error: passing argument 1 of 'thermal_cooling_device_register' discards 'const' qualifier from pointer target type [-Werror=discarded-qualifiers]
134 | cdev = thermal_cooling_device_register(wiphy_name(wiphy), phy,
| ^~~~~~~~~~~~~~~~~
In file included from drivers/net/wireless/mediatek/mt76/mt7915/init.c:7:
include/linux/thermal.h:407:39: note: expected 'char *' but argument is of type 'const char *'
407 | thermal_cooling_device_register(char *type, void *devdata,
| ~~~~~~^~~~

Change the dummy helper functions to have the same arguments as the
normal version.

Fixes: f991de53a8ab ("thermal: make device_register's type argument const")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210722090717.1116748-1-arnd@kernel.org

thermal/core: Remove thermal_notify_framework

thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point. The only
driver that was using thermal_notify_framework was updated in the previous
patch to use thermal_zone_device_update instead. Since there are no users
for thermal_notify_framework remove it.

Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-3-thara.gopinath@linaro.org

thermal/drivers/core: Use a char pointer for the cooling device name

We want to have any kind of name for the cooling devices as we do no
longer want to rely on auto-numbering. Let's replace the cooling
device's fixed array by a char pointer to be allocated dynamically
when registering the cooling device, so we don't limit the length of
the name.

Rework the error path at the same time as we have to rollback the
allocations in case of error.

Tested with a dummy device having the name:
"Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch"

A village on the island of Anglesey (Wales), known to have the longest
name in Europe.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Ido Schimmel <idosch@nvidia.com>
Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org

thermal/core: Make cooling device state change private

The change of the cooling device state should be used by the governor
or at least by the core code, not by the drivers themselves.

Remove the API usage and move the function declaration to the internal
headers.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20210118173824.9970-1-daniel.lezcano@linaro.org

thermal/core: Remove ms based delay fields

The code does no longer use the ms unit based fields to set the
delays as they are replaced by the jiffies.

Remove them and replace their user to use the jiffies version instead.

Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Peter Kästle <peter@piie.net>
Acked-by: Hans de Goede <hdegoede@redhat.com>
Link: https://lore.kernel.org/r/20201216220337.839878-3-daniel.lezcano@linaro.org

thermal/core: Precompute the delays from msecs to jiffies

The delays are stored in ms units and when the polling function is
called this delay is converted into jiffies at each call.

Instead of doing the conversion again and again, compute the jiffies
at init time and use the value directly when setting the polling.

Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201216220337.839878-1-daniel.lezcano@linaro.org

thermal/core: Remove unused macro THERMAL_TRIPS_NONE

The macro THERMAL_TRIPS_NONE is no longer used, remove it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201214233811.485669-6-daniel.lezcano@linaro.org

thermal/core: Remove the 'forced_passive' option

The code was reorganized in 2012 with the commit 0c01ebbfd3caf1.

The main change is a loop on the trip points array and a unconditional
call to the throttle() ops of the governors for each of them even if
the trip temperature is not reached yet.

With this change, the 'forced_passive' is no longer checked in the
thermal_zone_device_update() function but in the step wise governor's
throttle() callback.

As the force_passive does no belong to the trip point array, the
thermal_zone_device_update() can not compare with the specified
passive temperature, thus does not detect the passive limit has been
crossed. Consequently, throttle() is never called and the
'forced_passive' branch is unreached.

In addition, the default processor cooling device is not automatically
bound to the thermal zone if there is not passive trip point, thus the
'forced_passive' can not operate.

If there is an active trip point, then the throttle function will be
called to mitigate at this temperature and the 'forced_passive' will
override the mitigation of the active trip point in this case but with
the default cooling device bound to the thermal zone, so usually a
fan, and that is not a passive cooling effect.

Given the regression exists since more than 8 years, nobody complained
and at the best of my knowledge there is no bug open in
https://bugzilla.kernel.org, it is reasonable to say it is unused.

Remove the 'forced_passive' related code.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201214233811.485669-1-daniel.lezcano@linaro.org

thermal/core: Remove notify ops

With the removal of the notifys user in a previous patches, the ops is no
longer needed, remove it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20201210121514.25760-5-daniel.lezcano@linaro.org

thermal/core: Add critical and hot ops

Currently there is no way to the sensors to directly call an ops in
interrupt mode without calling thermal_zone_device_update assuming all
the trip points are defined.

A sensor may want to do something special if a trip point is hot or
critical.

This patch adds the critical and hot ops to the thermal zone device,
so a sensor can directly invoke them or let the thermal framework to
call the sensor specific ones.

Tested-by: Kai-Heng Feng <kai.heng.feng@canonical.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20201210121514.25760-2-daniel.lezcano@linaro.org

thermal: cooling: Remove unused variable *tz

1. devfreq_cooling.c: The variable *tz is not used in
devfreq_cooling_get_requested_power(), devfreq_cooling_state2power()
and devfreq_cooling_power2state().

2. cpufreq_cooling.c: After 84fe2cab48590, the variable *tz is not used
anymore in cpufreq_get_requested_power(), cpufreq_state2power() and
cpufreq_power2state().

Remove the variable *tz.

Signed-off-by: zhuguangqing <zhuguangqing@xiaomi.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200914071101.13575-1-zhuguangqing83@gmail.com

thermal: core: Add new event for sending keep alive notifications

This event is sent by the platform firmware to confirm that
user space thermal solution is alive. The response to this event
from the user space thermal solution is platform specific.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200915223650.406046-3-srinivas.pandruvada@linux.intel.com

thermal: core: genetlink support for events/cmd/sampling

Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.

The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.

At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.

The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.

The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.

This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.

In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.

Also, a list of commands to discover the thermal setup is added and
can be extended when needed.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org

thermal: Make thermal_zone_device_is_enabled() available to core only

This function is not needed by drivers.

Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200703104354.19657-4-andrzej.p@collabora.com

thermal: Rename set_mode() to change_mode()

set_mode() is only called when tzd's mode is about to change. Actual
setting is performed in thermal_core, in thermal_zone_device_set_mode().
The meaning of set_mode() callback is actually to notify the driver about
the mode being changed and giving the driver a chance to oppose such
change.

To better reflect the purpose of the method rename it to change_mode()

Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-12-andrzej.p@collabora.com

thermal: Add mode helpers

Prepare for making the drivers not access tzd's private members.

Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[staticize thermal_zone_device_set_mode()]
Signed-off-by: kernel test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-7-andrzej.p@collabora.com

thermal: remove get_mode() operation of drivers

get_mode() is now redundant, as the state is stored in struct
thermal_zone_device.

Consequently the "mode" attribute in sysfs can always be visible, because
it is always possible to get the mode from struct tzd.

Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-6-andrzej.p@collabora.com

thermal: Add current mode to thermal zone device

Prepare for changing the place where the mode is stored: now it is in
drivers, which might or might not implement get_mode()/set_mode() methods.
A lot of cleanup can be done thanks to storing it in struct tzd. The
get_mode() methods will become redundant.

Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-4-andrzej.p@collabora.com

thermal: Remove thermal_zone_device_update() stub

All users of the function depends on THERMAL, no stub is
needed. Remove it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-9-daniel.lezcano@linaro.org

thermal: Remove stubs for thermal_zone_[un]bind_cooling_device

All callers of the functions depends on THERMAL, it is pointless to
define stubs. Remove them.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-8-daniel.lezcano@linaro.org

thermal: Change IS_ENABLED to IFDEF in the header file

The thermal framework can not be compiled as a module. The IS_ENABLED
macro is useless here and can be replaced by an ifdef.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-7-daniel.lezcano@linaro.org

thermal: Move get_thermal_instance to the internal header

The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.

Move the definition to the internal header and allow better
self-encapsulation.

Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org

thermal: Move get_tz_trend to the internal header

The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.

Move the definition to the internal header and allow better
self-encapsulation.

Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org

thermal: Move trip point structure definition to private header

The struct thermal_trip is only used by the thermal internals, it is
pointless to export the definition in the global header.

Move the structure to the thermal_core.h internal header.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-4-daniel.lezcano@linaro.org

thermal: Move internal IPA functions

The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.

For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.

As the users depends on THERMAL then it is pointless to have the stub,
remove them.

Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org

thermal: Move struct thermal_attr to the private header

The structure belongs to the thermal core internals but it is exported
in the include/linux/thermal.h

For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the structure in the thermal core internal
header file.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-2-daniel.lezcano@linaro.org

thermal: Move default governor config option to the internal header

The default governor set at compilation time is a thermal internal
business, no need to export to the global thermal header.

Move the config options to the internal header.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org

thermal: core: Make thermal_zone_set_trips private

The function thermal_zone_set_trips() is used by the thermal core code
in order to update the next trip points, there are no other users.

Move the function definition in the thermal_core.h, remove the
EXPORT_SYMBOL_GPL and document the function.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200331165449.30355-1-daniel.lezcano@linaro.org

thermal: Fix build warning of !defined(CONFIG_THERMAL_OF)

Add "inline" to thermal_zone_of_get_sensor_id() function to avoid below
build warning of !defined(CONFIG_THERMAL_OF).

In file included from drivers/hwmon/hwmon.c:22:
include/linux/thermal.h:382:12: warning: 'thermal_zone_of_get_sensor_id'
defined but not used [-Wunused-function]
382 | static int thermal_zone_of_get_sensor_id(struct device_node *tz_np,

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583222684-10229-1-git-send-email-Anson.Huang@nxp.com

thermal: of-thermal: add API for getting sensor ID from DT

This patch adds new API thermal_zone_of_get_sensor_id() to
provide the feature of getting sensor ID from DT thermal
zone's node. It's useful for thermal driver to register the
specific thermal zone devices from DT in a common way.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-2-git-send-email-Anson.Huang@nxp.com

thermal: remove kelvin to/from Celsius conversion helpers from <linux/thermal.h>

This removes the kelvin to/from Celsius conversion helper macros in
<linux/thermal.h> which were switched to the inline helper functions in
<linux/units.h>.

Link: http://lkml.kernel.org/r/1576386975-7941-9-git-send-email-akinobu.mita@gmail.com
Signed-off-by: Akinobu Mita <akinobu.mita@gmail.com>
Reviewed-by: Andy Shevchenko <andy.shevchenko@gmail.com>
Cc: Sujith Thomas <sujith.thomas@intel.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Andy Shevchenko <andy@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Keith Busch <kbusch@kernel.org>
Cc: Jens Axboe <axboe@fb.com>
Cc: Christoph Hellwig <hch@lst.de>
Cc: Sagi Grimberg <sagi@grimberg.me>
Cc: Emmanuel Grumbach <emmanuel.grumbach@intel.com>
Cc: Hartmut Knaack <knaack.h@gmx.de>
Cc: Johannes Berg <johannes.berg@intel.com>
Cc: Jonathan Cameron <jic23@kernel.org>
Cc: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Kalle Valo <kvalo@codeaurora.org>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Luca Coelho <luciano.coelho@intel.com>
Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net>
Cc: Stanislaw Gruszka <sgruszka@redhat.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>

thermal: Remove netlink support

There are no users of netlink messages for thermal inside the kernel.
Remove the code and adjust the documentation.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/8ff02cf62186c7a54fff325fad40a2e9ca3affa6.1571656014.git.amit.kucheria@linaro.org

docs: thermal: add it to the driver API

The file contents mostly describes driver internals.

Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>
Signed-off-by: Jonathan Corbet <corbet@lwn.net>

docs: thermal: convert to ReST

Rename the thermal documentation files to ReST, add an
index for them and adjust in order to produce a nice html
output via the Sphinx build system.

At its new index.rst, let's add a :orphan: while this is not linked to
the main index.rst file, in order to avoid build warnings.

Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Introduce devm_thermal_of_cooling_device_register

thermal_of_cooling_device_register() and thermal_cooling_device_register()
are typically called from driver probe functions, and
thermal_cooling_device_unregister() is called from remove functions. This
makes both a perfect candidate for device managed functions.

Introduce devm_thermal_of_cooling_device_register(). This function can
also be used to replace thermal_cooling_device_register() by passing a NULL
pointer as device node. The new function requires both struct device *
and struct device_node * as parameters since the struct device_node *
parameter is not always identical to dev->of_node.

Don't introduce a device managed remove function since it is not needed
at this point.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: make device_register's type argument const

...because it can be, the buffer is strlcpy'd into a local buffer in a
thermal struct member.

Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

drivers: thermal: Update license to SPDX format

Update licences format for core thermal files.

Signed-off-by: Lina Iyer <ilina@codeaurora.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add cooling device's statistics in sysfs

This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.

The write-only "reset" file is used to reset the statistics.

The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.

The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.

The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.

This is how the directory structure looks like for a single cooling
device:

$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state max_state power stats subsystem type uevent

/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms runtime_active_time runtime_suspended_time
control runtime_status

/sys/class/thermal/cooling_device0/stats:
reset time_in_state_ms total_trans trans_table

This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal : Remove const to make same prototype

Here, prototype of thermal_zone_device_register is not matching
with static inline thermal_zone_device_register. One is using
const thermal_zone_params. Other is using non-const.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: int3400_thermal: process "thermal table changed" event

Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.

Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal core: convert ID allocation to IDA

The thermal core does not use the ability to look up pointers by ID, so
convert it from using an IDR to the more space-efficient IDA.

Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: core: move trips attributes to tz->device.groups

Finally, move the last thermal zone sysfs attributes to
tz->device.groups: trips attributes. This requires adding a
attribute_group to thermal_zone_device, creating it dynamically, and
then setting all trips attributes in it. The trips attribute is then
added to the tz->device.groups.

As the removal of all attributes are handled by device core, the device
remove calls are not needed anymore.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Enhance thermal_zone_device_update for events

Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: streamline get_trend callbacks

The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);

Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.

While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: of: implement .set_trips for device tree thermal zones

This patch implements .set_trips for device tree thermal zones.
As the hardware-tracked trip points is supported by thermal core patch[0].

patch[0]
"thermal: Add support for hardware-tracked trip points".

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add support for hardware-tracked trip points

This adds support for hardware-tracked trip points to the device tree
thermal sensor framework.

The framework supports an arbitrary number of trip points. Whenever
the current temperature is updated, the trip points immediately
below and above the current temperature are found. A .set_trips
callback is then called with the temperatures. If there is no trip
point above or below the current temperature, the passed trip
temperature will be -INT_MAX or INT_MAX respectively. In this callback,
the driver should program the hardware such that it is notified
when either of these trip points are triggered. When a trip point
is triggered, the driver should call `thermal_zone_device_update'
for the respective thermal zone. This will cause the trip points
to be updated again.

If .set_trips is not implemented, the framework behaves as before.

This patch is based on an earlier version from Mikko Perttunen
<mikko.perttunen@kapsi.fi>

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: core: export apis to get slope and offset

Add apis for platform thermal drivers to query for slope and offset
attributes, which might be needed for temperature calculations.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: add the note for set_trip_temp

Fixes commit 60f9ce3ada53
("thermal: of-thermal: allow setting trip_temp on hardware")

Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: of-thermal: allow setting trip_temp on hardware

In current of-thermal, the .set_trip_temp only support to
set trip_temp for SW. But some sensors support to set
trip_temp on hardware, so that can trigger interrupt,
shutdown or any other events.
This patch adds .set_trip_temp() callback in
thermal_zone_of_device_ops{}, so that the sensor device can
use it to set trip_temp on hardware.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: consistently use int for trip temp

The commit 17e8351a7739 consistently use int for temperature,
however it missed a few in trip temperature and thermal_core.

In current codes, the trip->temperature used "unsigned long"
and zone->temperature used"int", if the temperature is negative
value, it will get wrong result when compare temperature with
trip temperature.

This patch can fix it.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal: Ignore invalid trip points

In some cases, platform thermal driver may report invalid trip points,
thermal core should not take any action for these trip points.

This fixed a regression that bogus trip point starts to screw up thermal
control on some Lenovo laptops, after
commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461
Author: Zhang Rui <rui.zhang@intel.com>
Date: Fri Oct 30 16:31:47 2015 +0800

Thermal: initialize thermal zone device correctly

After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().

Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.

Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>

CC: <stable@vger.kernel.org> #3.18+
Link: https://bugzilla.redhat.com/show_bug.cgi?id=1317190
Link: https://bugzilla.kernel.org/show_bug.cgi?id=114551
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: of-thermal: Add devm version of thermal_zone_of_sensor_register

Add resource managed version of thermal_zone_of_sensor_register() and
thermal_zone_of_sensor_unregister().

This helps in reducing the code size in error path, remove of
driver remove callbacks and making proper sequence for deallocations.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal: do thermal zone update after a cooling device registered

When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.

This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.

Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/

CC: <stable@vger.kernel.org> #3.18+
Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>

Thermal: initialize thermal zone device correctly

After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().

Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.

CC: <stable@vger.kernel.org> #3.18+
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>

thermal: fix thermal_zone_bind_cooling_device prototype

When the prototype for thermal_zone_bind_cooling_device
changed, the static inline wrapper function was left alone,
which in theory can cause build warnings:

I have seen this error in the past:
drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind':
drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device'
ret = thermal_zone_bind_cooling_device(thermal, i, cdev,

while this one no longer shows up, there is no doubt that
the prototype is still wrong, so let's just fix it anyway.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: 6cd9e9f629f1 ("thermal: of: fix cooling device weights in device tree")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

linux/thermal.h: rename KELVIN_TO_CELSIUS to DECI_KELVIN_TO_CELSIUS

The macros KELVIN_TO_CELSIUS and CELSIUS_TO_KELVIN actually convert
between deciKelvins and Celsius, so rename them to reflect that. While
at it, use a statement expression in DECI_KELVIN_TO_CELSIUS to prevent
expanding the argument multiple times and get rid of a few casts.

Signed-off-by: Rasmus Villemoes <linux@rasmusvillemoes.dk>
Acked-by: Darren Hart <dvhart@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Add a function to get the minimum power

The thermal core already has a function to get the maximum power of a
cooling device: power_actor_get_max_power(). Add a function to get the
minimum power of a cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Fix thermal_zone_of_sensor_register to match documentation

thermal_zone_of_sensor_register is documented as returning a pointer
to either a valid thermal_zone_device on success, or a corresponding
ERR_PTR() value.

In contrast, the function returns NULL when THERMAL_OF is configured
off. Fix this.

Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: consistently use int for temperatures

The thermal code uses int, long and unsigned long for temperatures
in different places.

Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.

'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.

Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: support slope and offset coefficients

It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.

This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.

The constants are available through sysfs.

It is up to the device driver to determine
the usage of these values.

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: introduce the Power Allocator governor

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: extend the cooling device API to include power information

Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: let governors have private data for each thermal zone

A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.

The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: fair_share: generalize the weight concept

The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.

This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.

It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: of: fix cooling device weights in device tree

Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Introduce dummy functions when thermal is not defined

When CONFIG_THERMAL is not enabled, it is better to introduce
equivalent dummy functions in the exported header than to
introduce #ifdeffery in drivers using the function.

This will prevent issues such as that reported in:
http://www.spinics.net/lists/linux-next/msg31573.html

While at it switch over to IS_ENABLED for thermal macros
to allow for thermal framework to be built as framework
and relevant APIs be usable by relevant drivers as a result.

Reported-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit

The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.

On 64-bit systems, cooling devices registered via of-thermal apis fail
to bind when the min/max cooling state is specified as
THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read
from the device tree (32bit) and the pre-processor define (64bit).

As we're unlikely to need cooling states larger than 32 bits, and for
consistency with the size of phandle arguments, explicitly limit
THERMAL_NO_LIMIT to 32 bits.

Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: provide an UAPI header file

include/linux/thermal.h contains definitions for the Thermal generic
netlink family, but none of the valuable information relevant to
user-space such as the Genl family name, multicast group, version or
command set and data types is exported to user-space.

Export all the relevant generic netlink information to user-space to
make this genl family usable by user-space, and while at it, export
THERMAL_NAME_LENGTH since it limits name length for thermal_hwmon
devices.

Kbuild and MAINTAINERS are also updated accordingly to reflect this new
file: include/uapi/linux/thermal.h.

Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: of: Extend current of-thermal.c code to allow setting emulated temp

Before this change it was only possible to set get_temp() and get_trend()
methods to be used in the common code handling passing parameters via
device tree to "cpu-thermal" CPU thermal zone device.

Now it is possible to also set emulated value of temperature for debug
purposes.

Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: of: Rename struct __thermal_trip to struct thermal_trip

This patch changes name of struct __thermal_trip to thermal_trip and moves
declaration of the latter to ./include/linux/thermal.h for better visibility.

Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

thermal: of: improve of-thermal sensor registration API

Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.

The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.

This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.

Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Alexandre Courbot <acourbot@nvidia.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Thermal: introduce INT3402 thermal driver

ACPI INT3402 device object could report temperature for the memory module.
To expose such information to user space, a thermal zone device is registered
for it so that the thermal sysfs interface can expose such information for
userspace to use.

Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h

This macro can be used by other component so move it to a common header,
but in a slightly different way: define two macros, one macro with an
offset and the other doesn't.

Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: document struct thermal_zone_device and thermal_governor

Document struct thermal_zone_device and struct thermal_governor fields
and their use by the thermal framework code.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: core: introduce thermal_of_cooling_device_register

This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.

This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: introduce device tree parser

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: thermal_core: allow binding with limits on bind_params

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

drivers: thermal: make usage of CONFIG_THERMAL_HWMON optional

When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.

This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.

In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.

Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: rename notify_thermal_framework to thermal_notify_framework

To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: expose thermal_zone_get_temp API

This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.

Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: introduce thermal_zone_get_zone_by_name helper function

This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: build thermal governors into thermal_sys module

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>

thermal: Fix compiler warning

The following warning is obtained when CONFIG_NET is not defined:

In file included from drivers/thermal/mvebu_thermal.c:27:0:
include/linux/thermal.h:254:12: warning: 'thermal_generate_netlink_event'
defined but not used [-Wunused-function]

This patch fixes the warning by properly inlining
thermal_generate_netlink_event().

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: exynos: fix cooling state translation

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>

thermal: shorten too long mcast group name

The original name is too long.

Signed-off-by: Masatake YAMATO <yamato@redhat.com>
Signed-off-by: David S. Miller <davem@davemloft.net>

thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation

This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

thermal: Use thermal zone device id in netlink messages

This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Introduce THERMAL_TREND_RAISE_FULL and THERMAL_TREND_DROP_FULL

These two new thermal_trend types are used to tell the governor
that the temeprature is raising/dropping quickly.

Thermal cooling governors should handle this situation and make
proper decisions, e.g. set cooling state to upper/lower limit directly
instead of one step each time.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Fix DEFAULT_THERMAL_GOVERNOR

Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the
default governor selected in kernel config file.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add a notification API

This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Make thermal_cdev_update as a global function

This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add thermal governor registration APIs

This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Pass zone parameters as argument to tzd_register

This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add platform level information to thermal.h

This patch adds platform level information to thermal.h
by introducing two structures to hold:
* bind parameters for a thermal zone,
* zone level platform parameters

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Add get trend, get instance API's to thermal_sys

This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
* get_tz_trend: obtain the trend of the given thermal zone
* get_thermal_instance: obtain the instance corresponding
to the given tz, cdev and the trip point.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Refactor thermal.h file

This patch rearranges the code in thermal.h file,
in the following order, so that it is easy to
read/maintain.
1. All #defines
2. All enums
3. All fops structures
4. All device structures
5. All function declarations

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Thermal: Introduce locking for cdev.thermal_instances list.

we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

Thermal: Unify the code for both active and passive cooling

Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

Thermal: Introduce simple arbitrator for setting device cooling state

This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

Thermal: List thermal_instance in thermal_cooling_device.

List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

Thermal: Rename thermal_zone_device.cooling_devices

Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

Thermal: Remove tc1/tc2 in generic thermal layer.

Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>

Thermal: Introduce .get_trend() callback.

According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>

Thermal: set upper and lower limits

set upper and lower limits when binding
a thermal cooling device to a thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>

thermal: Constify 'type' argument for the registration routine

thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:

CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'

Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>

Thermal: Add Hysteresis attributes

The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.

This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

Thermal: Make Thermal trip points writeable

Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: Rename generate_netlink_event

It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: make THERMAL_HWMON implementation fully internal

THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:

* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
disabled.

* This avoids breaking the thermal kABI in these cases too, which should
make distributions happy.

The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone. But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>

ACPI: Fix build for CONFIG_NET unset

Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>

thermal: Add event notification to thermal framework

This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.

Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: make ops constant

And while touching that function definition do something about the disaster
of formatting there.

Signed-off-by: Alan Cox <alan@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: support forcing support for passive cooling

Due to poor thermal design or Linux driving hardware outside its thermal
envelope, some systems will reach critical temperature and shut down
under high load. This patch adds support for forcing a polling-based
passive trip point if the firmware doesn't provide one. The assumption
is made that the processor is the most practical means to reduce the
dynamic heat generation, so hitting the passive thermal limit will cause
the CPU to be throttled until the temperature stabalises around the
defined value.

UI is provided via a "passive" sysfs entry in the thermal zone
directory. It accepts a decimal value in millidegrees celsius, or "0" to
disable the functionality. Default behaviour is for this functionality
to be disabled.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>

ACPI: move thermal trip handling to generic thermal layer

The ACPI code currently carries its own thermal trip handling, meaning that
any other thermal implementation will need to reimplement it. Move the code
to the generic thermal layer.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: use integers rather than strings for thermal values

The thermal API currently uses strings to pass values to userspace. This
makes it difficult to use from within the kernel. Change the interface
to use integers and fix up the consumers.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Thomas Renninger <trenn@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: Create CONFIG_THERMAL_HWMON=n

A bug in libsensors <= 2.10.6 is exposed
when this new hwmon I/F is enabled.
Create CONFIG_THERMAL_HWMON=n
until some time after libsensors 2.10.7 ships
so those users can run the latest kernel.

libsensors 3.x is already fixed -- those users
can use CONFIG_THERMAL_HWMON=y now.

Signed-off-by: Rene Herman <rene.herman@gmail.com>
Acked-by: Mark M. Hoffman <mhoffman@lightlink.com>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add hwmon sysfs I/F

Add hwmon sys I/F for generic thermal driver.

Note: we have one hwmon class device for EACH TYPE of the thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add new get_crit_temp callback

Add a new callback so that the generic thermal can get
the critical trip point info of a thermal zone,
which is needed for building the tempX_crit hwmon sysfs attribute.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>

thermal: add the support for building the generic thermal as a module

Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>

acpi thermal trip points increased to 12

The THERMAL_MAX_TRIPS value is set to 10. It is too few for the Compaq AP550
machine which has 12 trip points.

Signed-off-by: Krzysztof Helt <krzysztof.h1@wp.pl>
Cc: Len Brown <lenb@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>

ACPI: thermal: buildfix for CONFIG_THERMAL=n

This fixes the build, but acpi_fan_add() still needs
to be updated to handle thermal_cooling_device_register()
returning NULL as a non-fatal condition.

Signed-off-by: Len Brown <len.brown@intel.com>

ACPI: CELSIUS_TO_KELVIN fixup

Fix an imprecision in CELSIUS_TO_KELVIN and move these
two macroes to a proper place.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

the generic thermal sysfs driver

The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>