remoteproc: k3-dsp: Use devm_rproc_add() helper

Use device lifecycle managed devm_rproc_add() helper function. This helps
prevent mistakes like deleting out of order in cleanup functions and
forgetting to delete on all error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240205182753.36978-6-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Use devm_ioremap_wc() helper

Use a device lifecycle managed ioremap helper function. This helps prevent
mistakes like unmapping out of order in cleanup functions and forgetting
to unmap on all error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240205182753.36978-5-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Add devm action to release tsp

Use a device lifecycle managed action to release tps ti_sci_proc handle.
This helps prevent mistakes like releasing out of order in cleanup
functions and forgetting to release on error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240205182753.36978-4-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Use devm_kzalloc() helper

Use device lifecycle managed devm_kzalloc() helper function. This helps
prevent mistakes like freeing out of order in cleanup functions and
forgetting to free on all error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240205182753.36978-3-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Use devm_ti_sci_get_by_phandle() helper

Use the device lifecycle managed TI-SCI get() function. This helps prevent
mistakes like not put()'ing in the wrong order in cleanup functions and
forgetting to put() on error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240205182753.36978-2-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Use devm_kcalloc() helper

Use a device lifecycle managed action to free memory. This helps prevent
mistakes like freeing out of order in cleanup functions and forgetting to
free on error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240123184913.725435-3-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Add devm action to release reserved memory

Use a device lifecycle managed action to release reserved memory. This
helps prevent mistakes like releasing out of order in cleanup functions
and forgetting to release on error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240123184913.725435-2-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Use devm_rproc_alloc() helper

Use the device lifecycle managed allocation function. This helps prevent
mistakes like freeing out of order in cleanup functions and forgetting to
free on error paths.

Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20240123184913.725435-1-afd@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Convert to platform remove callback returning void

The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.

To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().

There is no change in behaviour as .remove() already returned zero
unconditionally.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Link: https://lore.kernel.org/r/20231123211657.518181-8-u.kleine-koenig@pengutronix.de
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Use symbolic error codes in error messages

The error message

failed to send mailbox message (-EINVAL)

is (for a human) more useful than

failed to send mailbox message, status = -22

Adapt all error messages to use the symbolic names instead of the
numeric constants. The error paths in .probe() make use of
dev_err_probe() which automatically handles EPROBE_DEFER.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Link: https://lore.kernel.org/r/20231123211657.518181-7-u.kleine-koenig@pengutronix.de>
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Suppress duplicate error message in .remove()

When the remove callback returns non-zero, the driver core emits an
error message about the error value being ignored. As the driver already
emits an error message already, return zero. This has no effect apart
from suppressing the core's message. The platform device gets unbound
irrespective of the return value.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Link: https://lore.kernel.org/r/20231123211657.518181-6-u.kleine-koenig@pengutronix.de
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: Explicitly include correct DT includes

The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.

Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230714174935.4063513-1-robh@kernel.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>

remoteproc: k3-c7x: Add support for C7xv DSP on AM62A SoC

Add support to the K3 DSP remoteproc driver to configure the C7xv
subsystem core on AM62A SoCs. The C7xv susbsytem is based on C71 DSP
with anlytics engine for deep learning purposes. The remoteproc
handling for device management is similar to the C66/C71 DSPs on K3
J7 family SoCs, even though there are additional hardware accelerators
and IP updates to C7xv subsystem.

Signed-off-by: Jai Luthra <j-luthra@ti.com>
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Link: https://lore.kernel.org/r/20221230132453.32022-3-hnagalla@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: k3-dsp: Add support for IPC-only mode for all K3 DSPs

Add support to the K3 DSP remoteproc driver to configure all the C66x
and C71x cores on J721E SoCs to be either in IPC-only mode or the
traditional remoteproc mode. The IPC-only mode expects that the remote
processors are already booted by the bootloader, and only perform the
minimum steps required to initialize and deinitialize the virtio IPC
transports. The remoteproc mode allows the kernel remoteproc driver to
do the regular load and boot and other device management operations for
a DSP.

The IPC-only mode for a DSP is detected and configured at driver probe
time by querying the System Firmware for the DSP power and reset state
and/or status and making sure that the DSP is indeed started by the
bootloaders, otherwise the device is configured for remoteproc mode.

Support for IPC-only mode is achieved through .attach(), .detach() and
.get_loaded_rsc_table() callback ops and zeroing out the regular rproc
ops .prepare(), .unprepare(), .start() and .stop(). The resource table
follows a design-by-contract approach and is expected to be at the base
of the DDR firmware region reserved for each remoteproc, it is mostly
expected to contain only the virtio device and trace resource entries.

NOTE:
The driver cannot configure a DSP core for remoteproc mode by any
means without rebooting the kernel if that DSP core has been started
by a bootloader. This is the current desired behavior and can be
enhanced in the future if the feature is needed.

Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220213201246.25952-6-s-anna@ti.com

remoteproc: k3-dsp: Refactor mbox request code in start

Refactor out the mailbox request and associated ping logic code
from k3_dsp_rproc_start() function into its own separate function
so that it can be re-used in the soon to be added .attach() ops
callback.

Signed-off-by: Suman Anna <s-anna@ti.com>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220213201246.25952-5-s-anna@ti.com

remoteproc: k3-dsp: Extend support for C71x DSPs on J721S2 SoCs

The K3 J721S2 SoCs have two C71x DSP subsystems in MAIN voltage domain,
and there are no C66x DSP subsystems on these SoCs. The C71x DSP subsystem
is a slighly updated version of the C71x DSP subsystem on J721e. The
C71x DSPs are 64 bit machine with fixed and floating point DSP
operations.

Extend support to the C71x DSPs with J721S2 compatible strings.

Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Link: https://lore.kernel.org/r/20211122122726.8532-4-hnagalla@ti.com
Signed-off-by: Mathieu Poirier <mathieu.poirier@linaro.org>

remoteproc: Fix spelling mistake "atleast" -> "at least"

There are spelling mistakes dev_err messages. Fix them.

Signed-off-by: Colin Ian King <colin.king@canonical.com>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20210826123735.14650-1-colin.king@canonical.com

remoteproc: add is_iomem to da_to_va

Introduce an extra parameter is_iomem to da_to_va, then the caller
could take the memory as normal memory or io mapped memory.

Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Reported-by: kernel test robot <lkp@intel.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Link: https://lore.kernel.org/r/1615029865-23312-5-git-send-email-peng.fan@oss.nxp.com
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>

remoteproc: k3-dsp: Fix return value check in k3_dsp_rproc_of_get_memories()

In case of error, the function devm_ioremap_wc() returns NULL pointer
not ERR_PTR(). The IS_ERR() test in the return value check should be
replaced with NULL test.

Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Fixes: 6edbe024ba17 ("remoteproc: k3-dsp: Add a remoteproc driver of K3 C66x DSPs")
Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Acked-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20200905122503.17352-1-yuehaibing@huawei.com
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>

remoteproc: k3-dsp: Add support for C71x DSPs

The Texas Instrument's K3 J721E SoCs have a newer next-generation
C71x DSP Subsystem in the MAIN voltage domain in addition to the
previous generation C66x DSP subsystems. The C71x DSP subsystem is
based on the TMS320C71x DSP CorePac module. The C71x CPU is a true
64-bit machine including 64-bit memory addressing and single-cycle
64-bit base arithmetic operations and supports vector signal processing
providing a significant lift in DSP processing power over C66x DSPs.
J721E SoCs use a C711 (a one-core 512-bit vector width CPU core) DSP
that is cache coherent with the A72 Arm cores.

Each subsystem has one or more Fixed/Floating-Point DSP CPUs, with 32 KB
of L1P Cache, 48 KB of L1D SRAM that can be configured and partitioned as
either RAM and/or Cache, and 512 KB of L2 SRAM configurable as either RAM
and/or Cache. The CorePac also includes a Matrix Multiplication Accelerator
(MMA), a Stream Engine (SE) and a C71x Memory Management Unit (CMMU), an
Interrupt Controller (INTC) and a Powerdown Management Unit (PMU) modules.

Update the existing K3 DSP remoteproc driver to add support for this C71x
DSP subsystem. The firmware loading support is provided by using the newly
added 64-bit ELF loader support, and is limited to images using only
external DDR memory at the moment. The L1D and L2 SRAMs are used as scratch
memory when using as RAMs, and cannot be used for loadable segments. The
CMMU is also not supported to begin with, and the driver is designed to
treat the MMU as if it is in bypass mode.

Signed-off-by: Suman Anna <s-anna@ti.com>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Link: https://lore.kernel.org/r/20200612225357.8251-3-s-anna@ti.com
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>

remoteproc: k3-dsp: Add support for L2RAM loading on C66x DSPs

The resets for the DSP processors on K3 SoCs are managed through the
Power and Sleep Controller (PSC) module. Each DSP typically has two
resets - a global module reset for powering on the device, and a local
reset that affects only the CPU while allowing access to the other
sub-modules within the DSP processor sub-systems.

The C66x DSPs have two levels of internal RAMs that can be used to
boot from, and the firmware loading into these RAMs require the
local reset to be asserted with the device powered on/enabled using
the module reset. Enhance the K3 DSP remoteproc driver to add support
for loading into the internal RAMs. The local reset is deasserted on
SoC power-on-reset, so logic has to be added in probe in remoteproc
mode to balance the remoteproc state-machine.

Note that the local resets are a no-op on C71x cores, and the hardware
does not supporting loading into its internal RAMs.

Signed-off-by: Suman Anna <s-anna@ti.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Link: https://lore.kernel.org/r/20200721223617.20312-7-s-anna@ti.com
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>

remoteproc: k3-dsp: Add a remoteproc driver of K3 C66x DSPs

The Texas Instrument's K3 J721E SoCs have two C66x DSP Subsystems in MAIN
voltage domain that are based on the TI's standard TMS320C66x DSP CorePac
module. Each subsystem has a Fixed/Floating-Point DSP CPU, with 32 KB each
of L1P & L1D SRAMs that can be configured and partitioned as either RAM
and/or Cache, and 288 KB of L2 SRAM with 256 KB of memory configurable as
either RAM and/or Cache. The CorePac also includes an Internal DMA (IDMA),
External Memory Controller (EMC), Extended Memory Controller (XMC) with a
Region Address Translator (RAT) unit for 32-bit to 48-bit address
extension/translations, an Interrupt Controller (INTC) and a Powerdown
Controller (PDC).

A new remoteproc module is added to perform the device management of
these DSP devices. The support is limited to images using only external
DDR memory at the moment, the loading support to internal memories and
any on-chip RAM memories will be added in a subsequent patch. RAT support
is also left for a future patch, and as such the reserved memory carveout
regions are all expected to be using memory regions within the first 2 GB.
Error Recovery and Power Management features are not currently supported.

The C66x remote processors do not have an MMU, and so require fixed memory
carveout regions matching the firmware image addresses. Support for this
is provided by mandating multiple memory regions to be attached to the
remoteproc device. The first memory region will be used to serve as the
DMA pool for all dynamic allocations like the vrings and vring buffers.
The remaining memory regions are mapped into the kernel at device probe
time, and are used to provide address translations for firmware image
segments without the need for any RSC_CARVEOUT entries. Any firmware
image using memory outside of the supplied reserved memory carveout
regions will be errored out.

The driver uses various TI-SCI interfaces to talk to the System Controller
(DMSC) for managing configuration, power and reset management of these
cores. IPC between the A72 cores and the DSP cores is supported through
the virtio rpmsg stack using shared memory and OMAP Mailboxes.

Signed-off-by: Suman Anna <s-anna@ti.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Link: https://lore.kernel.org/r/20200721223617.20312-6-s-anna@ti.com
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>